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HK Tech 300 Expo showcases hundreds of CityUHK incubated start-up innovations and achievements

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HONG KONG, May 23, 2025 /PRNewswire/ — City University of Hong Kong (CityUHK) held the HK Tech 300 Expo, a large-scale innovation and entrepreneurship exhibition, from 23 to 24 May 2025 at the University campus. The two-day event brought together about 300 start-ups incubated by CityUHK with more than 60 roadshows, demonstrating how the University’s world-class research achievements and innovative ideas translate into practical applications that foster positive social changes.  

Together with the Expo Opening Ceremony today (23 May 2025), CityUHK held the Launch Ceremony of the HK Tech 300 International Start-up Competition (HK Tech 300 International Competition), further expanding its innovation footprint onto the global stage.

Presiding over the ceremony were Professor Sun Dong, JP, Secretary for Innovation, Technology and Industry of the HKSAR Government, Mr Michael Ngai, Council Chairman of CityUHK, Mr Charles Chin Ying-on, Treasurer of CityUHK, and Professor Freddy Boey, President of CityUHK.

Also attending the ceremony were Mr Chaturont Chaiyakam, Consul-General of Thailand in the HKSAR, Mrs Le Duc Hanh, Consul-General of Vietnam in the HKSAR, and representatives from the governments and partner organisations of 12 mainland cities.

Professor Sun praised CityUHK‘s efforts in supporting young talent and nurturing start-ups. “CityUHK and HK Tech 300 play a crucial role in creating a vibrant ecosystem that fosters cross-disciplinary, cross-sector and cross-industry collaboration.  We must work together to support our young entrepreneurs, providing them with necessary resources, mentorship and opportunities to enhance their ideas into impactful solutions, further bolstering the development of Hong Kong as an international I&T hub.”

In his welcome speech, Mr Ngai said the Expo marks a significant milestone in the University’s journey to promote innovation and entrepreneurship. “CityUHK is dedicated to fostering a diverse environment for young talent, leveraging the robust support of the mainland, the University’s base in Hong Kong and global connectivity to equip our next generation to become future leaders with a global vision,” he said. 

“Innovation is the beacon of future development,” said Professor Boey in his vote of thanks. “The remarkable achievements of HK Tech 300 and the start-ups are closely linked to the extensive support from, and collaboration among, the Government, industry, the University and investors. CityUHK will continue to provide a world-class platform, empowering the growth of our young talent and deep-tech start-ups.”

Since its launch in 2021, HK Tech 300, CityUHK’s flagship innovation and entrepreneurship programme, has incubated over 900 start-ups, more than 200 of which have received up to HK$1M each in angel funding. Beyond financial support and patent resources, HK Tech 300 offers extensive assistance, including business matching and co-investment opportunities, leveraging the expertise of over 250 mentors from diverse industries, alongside partnerships with more than 100 public and private institutions.

The HK Tech 300 Expo showcases nearly 300 start-ups incubated by CityUHK, offering a range of innovative solutions in the fields of Biotech & Health, ICT & AI, Advanced tech & ESG, and Fintech. The expo also features remarkable teams recognised under the Government’s “Research, Academic and Industry Sectors One-plus Scheme (RAISe+)”, as well as business proposals from the inaugural graduates of the MSc in Venture Creation programme at the CityUHK Academy of Innovation.  

CityUHK expanded the reach of HK Tech 300 to include the national region in 2022 and the Southeast Asian region in 2023. The introduction of the HK Tech 300 International Competition will foster further cross-border collaboration to address pressing global challenges.

The HK Tech 300 International Competition will be held in partnership with 11 universities and five local partners, including business chambers and incubators from nine countries and cities: Brunei, Hungary, Indonesia, Kazakhstan, Malaysia, Thailand, Turkey, Vietnam and Hong Kong SAR, numerous of universities’ Vice-Chancellors and representatives attended the competition launch ceremony. The competition aims to attract aspiring talent and start-ups to Hong Kong and the mainland, leveraging the city’s unique advantages and resources. It also empowers our local start-ups to reach the international stage and promote the University’s technology transfer, fostering closer ties between the I&E ecosystem in Hong Kong and the rest of the world.

In addition to strategic partners, co-investors and supporting organisations from overseas and Mainland China, the event attracted legislative councillors, community leaders and school principals to witness the achievements of the start-ups. More than 60 innovation start-ups and research teams are participating in the Expo roadshows, fostering fruitful exchanges of innovation and business ideas. 

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SOURCE City University of Hong Kong

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Greater San Diego Science and Engineering Fair Students Win Big at the 75th California Science and Engineering Fair

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SAN DIEGO, April 26, 2026 /PRNewswire/ — The 75th California Science and Engineering Fair (CSEF) took place April 11–12 at California Lutheran University in Thousand Oaks, bringing together 900 of the best of 1st place winners from regional competitions covering 58 counties across the state, including the Greater San Diego Science and Engineering Fair (GSDSEF). GSDSEF students earned 40 awards at the event, including two of only six highly coveted spots to the prestigious Regeneron International Science and Engineering Fair (ISEF). Seven students earned 1st Place awards in the categories of Biochemistry and Molecular Biology, Chemistry, Cognitive Science, Microbiology, Physics and Astronomy, and Zoology. In addition, one student won the Saban Family Foundation Scholar Prize, while another won the South Coast AQMD Air Quality Award and A&WMA Environmental Leadership Award. CSEF is the oldest science fair west of the Mississippi River and the highest level competition in the state.

Top winners were:

Arya Bhatt, Grade 7, Oak Valley Middle School, South Coast AQMD Air Quality Award, A&WMA Environmental Leadership Award, “Context Aware Real Time Air Quality Prediction Using Machine Learning”.

Joie Green, Grade 8, Muirlands Middle School, 1st Place, “Soon I will be Invisible: How to Direct Energy with Topological Metamaterials”.

Maggie Hao, Grade 10, The Bishop’s School, 1st Place, “Harnessing Tardigrade Genes to Enhance Bacterial Biosensors for Heavy Metal Pollutant Detection”.

Uma Kattamuri, Grade 7, Oak Valley Middle School, 1st Place, “Elevated CO2 During Kalanchoe pinnata Growth Reveals Enhanced Antiproliferative and Synergistic Therapies”.

Sonika Dhenuva Konda, Grade 11, Del Norte High School, Saban Family Foundation Scholar Prize, “Adaptive Swarm Coordination for Wildfire Control via Q-Learning Tuned PSO with Quantum-Inspired Coupling”.

Emma Liu, Grade 11, The Bishop’s School, ISEF Finalist, 1st Place, “Defining 3D Phenotypic Cell States of Polymorphonuclear Neutrophils via Novel Computational Pipeline”.

Sharvi Mahajan, Grade 8, Bernardo Heights Middle School, 1st Place, “Evaluating Predictive EEG Theta/Beta Features in Adult ADHD via Machine Learning”.

Sydney O’Donnell, Grade 8, The Rhoades School, 1st Place, TFJIC, “Effects of Marigold Versus Chlorella Supplementation on Yolk Lutein Content”.

Ihan Sung, Grade 11, Eastlake High School, ISEF Finalist, 1st Place, “Renewable Ammonia Electrochemical Synthesis by Glow Discharge with an Iron Based Catalyst”.

Full results and project showcase available online.

About the GSDSEF

Since 1955, the Greater San Diego Science and Engineering Fair (GSDSEF) has provided an inspiring experience in science and engineering for tens of thousands of San Diego and Imperial County students, motivating them to pursue careers in science, technology, engineering, and mathematics. This regional competition challenges students to go beyond classroom studies to do independent research – to ask compelling questions, to design and implement innovative solutions, and to present and defend results to judges who are professionals in their fields. The GSDSEF brings together 800 of the best middle and high school students, 400+ judges who are professionals in their fields and over 60 professional societies and organizations, with $40k in prizes awarded.

The GSDSEF fosters creativity and innovation through inquiry, celebrates students’ STEM achievements, and showcases how young minds can make an impact in the present and future. Many of these student scientists are conducting world-class research and conducting groundbreaking experiments in fields ranging from Astronomy to Zoology, such as the discovery of cures for diseases, formulations of new vaccines, cancer research, applying AI to enhance medical diagnoses, using biomimicry for water conservation, novel drone technology, advances in micro robotics and autonomous driving technology. The GSDSEF is the highest-level STEM competition in the region and one of the oldest, most respected and competitive in the world. The GSDSEF is a 501(c)(3) organization. Learn more at gsdsef.org and follow us on LinkedIn and Instagram.

Copyright © 2026 Greater San Diego Science and Engineering Fair. All rights reserved.

Media Contact:
Sany Zakharia
sany.zakharia@gsdsef.org

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SOURCE Greater San Diego Science and Engineering Fair

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Innowise Named to 2026 CRN Tech Elite 250 List By The Channel Company

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WARSAW, Poland, April 26, 2026 /PRNewswire-PRWeb/ — Innowise has officially secured a position on CRN’s 2026 Tech Elite 250. This annual ranking identifies IT solution providers across the US and Canada that have achieved top-tier status within the partner programs of the industry’s leading technology vendors. The inclusion follows a period of verified growth in technical proficiency and a focus on high-impact engineering.

“Innowise concentrates on creating scalable, resilient architectures that produce measurable benefits for our clients. The honor of being recognized by CRN highlights the commitment of our experts to maintain high standards in highly competitive markets,” said Dmitry Nazarevich, CTO at Innowise.

About the Tech Elite 250

The Tech Elite 250 is a directory of companies recognized as having the highest level of partnership and certifications within the global IT ecosystem. In order to reach the final list, the provider must hold the most advanced technical credentials from vendors like AWS, Cisco, Dell, HPE, IBM, Intel, Nutanix, and Nvidia.

This directory serves as a verified ledger for enterprise clients who need to orchestrate complex hardware and software stacks without letting legacy environments rot. Holding these certifications is mandatory to stop the cash bleed caused by inefficient infrastructure and unoptimized cloud usage.

About Innowise

Founded in 2007, Innowise is a global software engineering and IT consulting center. The company is focused on developing high-value technologies, including artificial intelligence, data engineering, and cloud computing. Innowise crafts technological solutions for companies across 40+ domains in order to assist them in updating, creating, and modernizing their digital ecosystems.

Innowise specializes in using established technologies and modular approaches to enable organizations to expand or shift their operations while retaining complete control over all their physical and intangible assets.

Media Contact

Lizaveta Piaskova, Innowise, 48 48 787 027 706, lizaveta.piaskova@innowise.com, innowise.com

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SOURCE Innowise

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Neusoft Showcases Full-Stack & Global Innovations at Auto China 2026

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BEIJING, April 26, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Corporation hosted a press conference on April 25th and announced three key strategic moves: the iteration of Neusoft OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0, the launch of Neusoft NAGIC.AI Cockpit Software Platform, and the strategic upgrade of its subsidiary, Neusoft Smart Go. By leveraging full-stack technology and a global ecosystem to drive innovation and empowerment, Neusoft is transforming vehicles into proactive, connected and collaborative mobile intelligent spaces.

OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0: An Evolved AI Companion for Global Intelligent Mobility

Intelligent mobility requires proactive perception, scenario integration, and global connectivity to meet personalized user needs and complex driving scenarios. Neusoft, whose products cover over 130 countries and regions worldwide, addresses these challenges with its OneCoreGo® Global In-Vehicle Intelligent Mobility Solution 7.0 through AI-driven innovation and global ecosystem collaboration. Powered by One Mate’s cross-agent collaboration and a sub-product matrix including One Map, One Sight, One Cloud, One Pay, One Store, One Link, and One Guard, the solution delivers full-link global mobility services spanning navigation, in-cabin AR, payment, app ecosystem services, connectivity and security. By breaking down functional silos, it streamlines multi-step operations into a single “depart” command, leveraging full-stack AI technology across perception, decision-making, interaction, and execution processes.

Guan Xin, Vice President of Neusoft and General Manager of Neusoft Automotive Innovative Solutions Division, said, “Adhering to the core principles of AI and globalization, OneCoreGo® 7.0 keeps innovating, evolving into a globally intelligent mobility companion that truly understands user needs.”

To enhance driving safety and mobility efficiency, OneCoreGo® 7.0 has also comprehensively upgraded its sub-products: One Map Global Navigation newly introduces 3D city effects, 3D lane-level maps, and traffic light guidance, offering dedicated solutions for two-wheelers and commercial vehicles as well. One Sight AR For Car improves navigation display effects, reducing instances of taking wrong routes. One Pay In-Vehicle Payment achieves over 90% payment coverage for parking services across core European cities. Combined with One Cloud’s global compliance cloud monitoring platform and One Guard’s full-stack vehicle networking security services, it creates a truly comprehensive OneCoreGo® Global In-Vehicle Intelligent Mobility Solution.

Neusoft NAGIC.AI Cockpit Software Platform: Dual-track Architecture for AI Integration in Every Vehicle

Amid the AI-driven transformation of the automotive industry, the market faces two challenges: limited computing power in legacy vehicles and high adaptation difficulties for next-gen models. Neusoft’s NAGIC.AI Cockpit Software Platform adopts a flexible “distributed + centralized” dual-track architecture approach. For existing vehicle models, it introduces the AI BOX solution, rapidly boosting computing power via external AI computing units, significantly reducing upgrade costs and timelines. For new vehicle models built on next-gen central computing platforms, Neusoft provides a full-stack AI cockpit software product suite, meeting automakers’ stringent requirements for system stability, reliability, and full-domain control.

Pang Hongyan, Vice President of Neusoft and General Manager of the Automotive Intelligent Software Division, said, “Our dual-track architecture enables every vehicle to embrace AI and enjoy an intelligent future. Both existing models and new-generation vehicles can find the most suitable path to intelligentization.”

Moreover, Neusoft’s NAGIC.AI Cockpit Software Platform features scenario-based, human-centric AI Agents seamlessly integrating driving safety, occupant care services, intelligent assisted driving and in-cabin entertainment. Neusoft also collaborates with global ecosystem partners to drive intelligent upgrades of in-cabin interaction products, fostering a more open and dynamic intelligent cockpit ecosystem.

Strategic Upgrade of Neusoft Smart Go: A World-leading Provider of Full-Domain Upper-Body Electronics Solutions for Intelligent Vehicles

Aligning with the trend of E/E architecture evolution from distributed control to “central computing + zonal control”, Neusoft Smart Go, a subsidiary of Neusoft in the field of intelligent vehicle connectivity, has completed a strategic upgrade, aiming to become a global leader in full-domain upper-body electronics solutions for intelligent vehicles.

This strategic upgrade positions Neusoft Smart Go to focus on full-domain scenarios in upper-body electronics, building a product matrix covering full-category in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units, and pioneering the integration of large model algorithms.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “This strategic upgrade represents a significant leap from partial focus to comprehensive layout. Through our dual-track strategy of high-end cutting-edge solutions and mature standardized products, we can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide.” Neusoft Smart Go will provide mass-producible, adaptable hardware-software integrated solutions, empowering global automakers in achieving intelligent transformation.

Neusoft’s President, Mr.Gai Longjia stated, “In the future, Neusoft Smart Go will create stronger synergy with Neusoft Corporation by sharing internal technologies and capabilities while responding jointly to external demands. This specialized yet collaborative model will preserve business unit’s agility and expertise while enhancing Neusoft’s full-stack technological advantages.”

As a trusted partner in a smarter world, Neusoft is committed to collaborating with global automakers and ecosystem partners to build an open and inclusive intelligent automotive community together for the future of global mobility.

For more information about Neusoft, please visit www.neusoft.com.

 

View original content:https://www.prnewswire.com/apac/news-releases/neusoft-showcases-full-stack–global-innovations-at-auto-china-2026-302753701.html

SOURCE Neusoft Corporation

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