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AVEVA Expands CONNECT in India with New AI Capabilities to Accelerate Industrial Intelligence

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New AI capabilities empower local enterprises to safely scale operations, manage complexity, and drive sustainable growth.

MUMBAI, India, June 4, 2026 /PRNewswire/ — AVEVA, a global leader in industrial software, today announced a broad set of upcoming innovations for its industrial intelligence platform, CONNECT. Addressing the mounting challenge of data silos in the modern enterprise, the company is announcing a revolutionary industrial knowledge graph and a twin builder that applies agentic AI, slated for release in Q1 2027. By establishing a robust semantic model, this framework will act as the underlying architectural schematic that AI requires to deliver truly useful, accurate, and trusted outputs. Rather than feeding AI raw, disjointed information, this framework provides critical operational context by mapping the complex relationships between physical assets, empowering industrial teams to troubleshoot faster and make high-impact decisions with confidence.

The updates will make it faster and simpler for industrial organisations to put the full breadth of their industrial data to work, driving better decisions, stronger compliance, and AI-enhanced intelligent operations.

For industrial organisations, the pressure to adopt AI is intensifying, and so are the underlying challenges: complex regulatory environments, a growing sustainability imperative, ageing infrastructure and fragmented data. Today, up to 73% of all data collected within enterprises goes unused. Furthermore, 76% of business leaders report finding it difficult to understand their data. CONNECT bridges this gap by leveraging the cloud to empower ecosystems securely and seamlessly across the value chain, driving exponential business growth.

“For industrial enterprises globally, the challenge is not ambition but infrastructure,” shared Zubin Davar, VP – CONNECT Platform GTM. “The promise of AI remains largely unrealised for most industrial teams because operations data, engineering data, asset context, workflows, and compliance frameworks all need to be managed in one place without losing fidelity, lineage, or meaning. CONNECT is designed to close this gap across every layer of deeply heterogeneous industrial technology stacks. By lowering the cost and complexity of unifying industrial data, we help customers turn fragmented data into trusted intelligence, accelerating their AI-driven transformation.”

Accelerating industrial intelligence with customers and academia in India

Highlighting the strategic importance of the platform and its rapid adoption in the region, AVEVA announced the signing of Memorandums of Understanding (MoUs) with leading industry customers, including Deccan Fine Chemicals (I) Pvt. Limited, and Reliance Power Limited, at the India CONNECT launch event held in Mumbai. These strategic agreements are aimed at accelerating the implementation of CONNECT by leveraging cloud capabilities to enable a secure, seamless, and collaborative digital ecosystem across the value chain, driving sustainable and exponential business growth.

In addition, AVEVA signed an MoU with VJTI’s Technology Business Incubator (TBI), VJTI is an autonomous institution of repute, owned by the Maharashtra State Government, reinforcing its commitment to academia-led skill development and innovation and supporting the creation of a future-ready talent pool to meet evolving industry needs.

“The announcements at AVEVA World, coupled with these MoUs signed at the India CONNECT launch, reflect our commitment to matching the depth and pace of progress Indian enterprises are making,” said Tarun Singh, Country Head, AVEVA India. “India’s industrial sector is scaling rapidly, and by embedding AI and intelligence deeply into industrial workflows through CONNECT, we are helping local organizations move faster, manage complexity, and operate with confidence.”

CONNECT: expanding the data and AI ecosystem

To build on this momentum, AVEVA’s industrial intelligence platform CONNECT is significantly expanding its integrations with leading enterprise data platforms, introducing key capabilities critical to driving industrial pipeline generation and enterprise-wide transformation. Central to this expansion is a new strategic integration and partnership with Snowflake. Utilizing a zero-copy architecture, industrial enterprises can now query high-fidelity OT data directly within Snowflake without the need to duplicate or move data, ensuring a single source of truth while dramatically lowering latency and integration costs.

AVEVA is also streamlining data management with the launch of CONNECT Flows (formerly Crosser). This introduces new stream analytics and integration capabilities that enable the seamless assembly and deployment of data processing pipelines for real-time edge-to-cloud cleansing, filtering, and transformation. Simultaneously, the platform’s cloud and AI ecosystem is scaling rapidly. AVEVA is launching multicloud CONNECT in partnership with Amazon Web Services (AWS) to offer customers unprecedented hosting flexibility. Furthermore, the company is forging a new strategic and technology partnership with IFS and launching Digital Twins for AI Factories in collaboration with NVIDIA and Schneider Electric.

Looking ahead, a major CONNECT release is planned for Q1 2027, bringing a range of new capabilities, including an industrial knowledge graph that makes it faster to construct, enrich, and operationalise digital twins. Slated for an Early Access Program opening this year, this knowledge graph is populated using a twin builder that applies agentic AI to propose intelligent mappings, aligning existing, fragmented data sources to a standard data model. This radically accelerates time-to-value while preserving information lineage and ensuring rigorous data governance so every decision can be trusted.

By bringing these advanced data management and AI capabilities to the Indian market, AVEVA is empowering local enterprises to overcome data fragmentation and safely scale their digital transformation initiatives. As India continues its rapid industrial expansion, CONNECT provides the secure, unified foundation organizations need to turn complex operational data into a strategic asset.

About AVEVA

AVEVA is a global leader in industrial software, sparking ingenuity to drive responsible use of the world’s resources. Over 90% of leading industrial enterprises rely on AVEVA to help them deliver life’s essentials: safe, reliable energy, food, medicines, infrastructure and more. By connecting people with trusted information and AI-enriched insights, AVEVA helps them engineer capital projects more efficiently, operate better and create sustainable value, from the plant to the cloud and beyond. Through our industrial intelligence platform, CONNECT, and our trusted and secure information management applications enriched with industrial AI, AVEVA empowers businesses to drive deeper collaboration between teams and to accelerate insight across their ecosystem of suppliers, partners and customers. 

Named as one of the world’s most innovative companies, AVEVA’s open solutions draw on the expertise of more than 6,000 employees, 5,000 partners and 5,700 certified developers. The company, which has operations around the globe, is headquartered in Cambridge, UK. Learn more at www.aveva.com. 

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Smart City Expo 2026 speeds up towards urban solutions that yield real impact

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September 8, 2026

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BARCELONA, Spain, Sept. 8, 2026 /PRNewswire/ — Smart City Expo World Congress (SCEWC), the leading international event on cities and smart urban solutions organized by Fira de Barcelona, will hold its 2026 edition from November 3 to 5 at Barcelona’s Gran Via venue, bringing together 1,000 cities, more than 25,000 attendees, over 1,000 exhibitors and 600 speakers. Under the theme “Urban Solutions, Real Impact,” this year’s edition will place special focus on housing, one of the most pressing challenges facing cities worldwide, while showcasing technologies designed to deliver tangible, scalable impact.

The congress program is structured around seven tracks — Enabling Technologies, Energy & Environment, Mobility, Governance & Economy, Living & Inclusion, Infrastructure & Building, and Blue Economy — spanning digital transformation, artificial intelligence, green energy, governance and social equity.

Over 600 experts will take part in the sessions, including Nikolas Badminton, Chief Futurist and Think Tank leader at Futurist.com, who will share his vision on the future of cities. An artificial intelligence expert, Badminton helps companies and institutions build strategic foresight capabilities, identify the trends shaping the world, anticipate unforeseen risks, and prepare for complex, evolving environments through long-term thinking and scenario planning.

Ayumi Moore Aoki, founder of Women in Tech Global, will also participate in the congress. Her work focuses on the importance of diversity and inclusion as key drivers of innovation in the urban context. Moore Aoki underscores how inclusive leadership can support sustainable urban development at scale. The conference also features Bibiana Aido of UN Women, Bilel Jamoussi of the ITU, and Chiara Corazza of the Women’s Economic Forum, among others.

SCEWC will host the first edition of HOWS Barcelona, a new housing world summit that will focus on topics such as urban planning and land policy, housing regulation, social and affordable housing, and building renovation and reuse, opening a debate on the foundations of a new residential paradigm.

The exhibition floor will host global companies including Google, Microsoft, NVIDIA, Dell Technologies and Deutsche Telekom IoT, alongside a wide range of country and city pavilions and the new “Terra50” showcase, unveiling the world’s top 50 sustainability solutions in the urban field.

SCEWC 2026 will run jointly with Tomorrow.Mobility World Congress, Tomorrow.Blue Economy, HOWS Barcelona, Barcelona Deep Tech Summit, and Barcelona Cybersecurity Congress, consolidating Barcelona as a global meeting point for urban innovation this November.

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SOURCE Fira de Barcelona

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C-TOUCH & DISPLAY SHENZHEN 2026 to Showcase Breakthroughs in Micro LED Optical Interconnects, AI+AR Smart Glasses and TGV Glass Substrates

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September 8, 2026

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — As the global display and smart interaction industry enters a new phase of technological convergence and application expansion, C-TOUCH & DISPLAY SHENZHEN 2026 is set to spotlight emerging technologies and high-growth applications from October 27-29, 2026, at the Shenzhen World Exhibition & Convention Center (Bao’an), Halls 10, 12, 14 and 16.

With its 29-edition legacy, the 2026 show occupies 180,000 sqm of exhibition space, 3,600+ exhibitors, 170,000+ professional visitors and 5,000+ overseas buyers.

The exhibition will connect the global display ecosystem with new opportunities spanning Micro LED optical interconnects, AI+AR smart glasses, TGV glass substrates, smart cockpits, OLED flexible displays and advanced semiconductor packaging.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/81228

Three Emerging Technology Zones Highlight Next-Generation Growth

A major highlight of the 2026 edition will be three dedicated technology zones designed to connect emerging technologies with commercial applications.

The AI+AR Smart Glasses Zone will bring together leading companies across optical display modules, chips, materials, complete-device development and AI interaction solutions. With AI, spatial computing and lightweight wearable devices rapidly converging, the zone will demonstrate new applications in AR/VR, intelligent mobility, industrial inspection and healthcare.

The Micro LED AI Optical Interconnection & Glass Substrate Advanced Packaging Technology Zone will explore the convergence of display, photonics and AI computing. Technologies including Micro LED optical interconnect chips, CPO optical-module glass substrates, TGV equipment and materials, and intelligent manufacturing solutions will showcase emerging pathways for next-generation data centers and high-speed optical communication.

The TGV Glass Substrate Manufacturing Demonstration Line will provide a visual representation of the complete TGV manufacturing process, covering precision through-glass via technologies, thin-glass processing and advanced manufacturing. The initiative aims to accelerate collaboration among equipment suppliers, material providers, semiconductor packaging companies and end users.

From Display Innovation to Smart Applications

Beyond emerging technologies, C-TOUCH & DISPLAY SHENZHEN 2026 will cover the broader display and touch ecosystem, including Mini/Micro LED, OLED, commercial displays, automotive displays, smart cockpits, electronic paper, touch technologies, semiconductor packaging and consumer electronics manufacturing.

Leading industry players are expected to participate, creating opportunities for global buyers to identify suppliers, evaluate technologies and explore partnerships across multiple segments.

More than 20 professional forums and industry events will be held alongside the exhibition, covering new display technologies, commercial displays, automotive displays, AI+AR smart glasses, Micro LED optical communication and TGV technologies. These programs will provide insights into technology roadmaps, market trends and commercialization opportunities.

Connecting Global Buyers with Asia’s Technology Supply Chain

As a global sourcing and business platform, C-TOUCH & DISPLAY SHENZHEN 2026 connects international buyers with leading technologies, products and supply-chain solutions from across Asia’s display and semiconductor industries.

Through on-site business matchmaking, one-to-one sourcing meetings, international industry exchanges and expert-led discussions, global buyers will be able to efficiently identify qualified suppliers, evaluate advanced solutions, explore new sourcing opportunities and establish valuable business partnerships.

For more information, please visit our website: https://www.quanchu.com.cn/en-gb.html.

RX Kuozhan, a joint venture between Reed Exhibitions and Kuozhan Exhibition Services (Shanghai) Limited, was established in 2015. The company organizes leading B2B trade shows in Shenzhen, including C-TOUCH & DISPLAY SHENZHEN, FILM & TAPE EXPO, COMMERCIAL DISPLAY, AUTOMOTIVE DISPLAY SHENZHEN, ADHESIVES & CHEMICALS EXPO, and HIGHLY-FUNCTIONAL MATERIAL EXPO.

Committed to building one-stop platforms for sourcing, product discovery and industry exchange, RX Kuozhan connects global professionals with innovative technologies and solutions across display and touch, high-performance materials, consumer electronics, automotive electronics, new energy, smart manufacturing, printing and packaging.

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SOURCE RX Kuozhan

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FILM & TAPE EXPO 2026 to Connect Global Buyers with Asia’s Advanced Film, Tape and Coating Technologies

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September 8, 2026

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SHENZHEN, China, Sept. 7, 2026 /PRNewswire/ — Held by Kuozhan Exhibition Services (Shanghai) Limited, as part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies. As demand for high-performance materials accelerates across new energy, consumer electronics, automotive, semiconductors and advanced manufacturing, FILM & TAPE EXPO 2026 will return to Shenzhen from October 27-29, 2026, offering a comprehensive sourcing and technology platform for the global functional film, adhesive tape, coating and converting industries.

Covering 80,000 square meters, the 2026 edition is expected to bring together 1,200+ exhibitors and brands, 60,000+ professional buyers, 30+ technical forums and more than 200 new product launches. The exhibition will showcase the complete industry chain, from functional films and adhesive tapes to adhesives, chemical raw materials, high-performance materials, coating and converting equipment, testing technologies and supporting components.

Register Now to network with featured suppliers and gain insights into the latest industry trends: https://isclick.cn/57DB2

One Platform, Multiple High-Growth Applications

A key feature of FILM & TAPE EXPO 2026 is its application-driven approach, connecting material technologies with real-world procurement needs across major growth sectors.

In new energy and battery applications, exhibitors will showcase battery separator films, aluminum-plastic films, tab adhesives and other materials designed for high safety and energy-density requirements.

The automotive sector will feature TPU paint protection films, window films, color-changing films and advanced battery materials supporting vehicle lightweighting, electrification and intelligent mobility.

For display and touch applications, technologies including TAC films, PMMA films, OCA optical adhesives and optical films for backlight modules will address the evolving requirements of foldable displays, automotive displays and polarization technologies.

The consumer electronics and semiconductor sectors will feature release films, protective films, PI films, thermal-management materials, electronic tapes, wafer tapes and other precision materials supporting smartphones, wearables, electronic components, advanced packaging and semiconductor manufacturing.

Additional solutions will cover PCB/FPC, die-cutting, printing and labeling, flexible packaging, medical applications and industrial materials, enabling buyers to source across multiple applications at a single event.

Complete Supply Chain, From Materials to Manufacturing

The exhibition will bring together four major technology categories: functional films, adhesive tapes, adhesives and chemical raw materials, and converting equipment and components.

Product showcases will span PET, BOPET, BOPP, TPU, optical films, protective and release films, PI films, battery and photovoltaic films, automotive films, electronic and semiconductor tapes, OCA and thermal-management adhesives, coating and laminating systems, die-cutting and slitting equipment, inspection and measurement technologies, and other advanced manufacturing solutions.

With thousands of materials, equipment and processing solutions expected on site, the event provides international buyers with an efficient environment to compare technologies, identify suppliers and explore new applications.

Procurement-Focused Business Matching

Beyond exhibition displays, FILM & TAPE EXPO 2026 will place strong emphasis on measurable business outcomes. The exhibition’s Targeted Attendee Program (TAP) will facilitate more than 3,000 one-to-one business matchmaking meetings, connecting exhibitors with qualified buyers based on specific sourcing requirements.

Professional buyers from functional film and tape manufacturing, die-cutting, consumer electronics, automotive, display and touch, lithium batteries, semiconductors, PCB/FPC, printing and packaging are expected to participate, creating direct opportunities for supplier discovery and business collaboration.

30+ Forums to Explore the Next Wave of Materials Innovation

More than 30 conferences and technical forums will bring together industry experts and senior technology executives to discuss emerging opportunities in advanced PI films, automotive films, semiconductor adhesives, thermal-management materials, battery materials, coating and die-cutting technologies, MLCC materials, robotics and new material applications.

As part of ASIA MATERIAL WEEK, FILM & TAPE EXPO 2026 will also benefit from cross-industry connections spanning high-performance materials, adhesives, chemical raw materials and CMF technologies.

By bringing materials, technologies, applications and buyers together, FILM & TAPE EXPO 2026 aims to help global industry professionals discover new suppliers, identify emerging technologies and unlock the next wave of growth across Asia’s advanced materials supply chain.

For more information, please visit our website: https://www.film-expo.com/en-gb.html

FILM & TAPE EXPO 2026
October 27-29, 2026
Shenzhen World Exhibition & Convention Center (Bao’an), China

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SOURCE Kuozhan Exhibition Services (Shanghai) Limited

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