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Gallium Arsenide Components Market size is set to grow by USD 3.51 billion from 2024-2028, Rising adoption of smartphones and tablets boost the market, Technavio

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NEW YORK, July 2, 2024 /PRNewswire/ — The global gallium arsenide components market size is estimated to grow by USD 3.51 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.3% during the forecast period. Rising adoption of smartphones and tablets is driving market growth, with a trend towards increasing adoption of 4G and 5G networks. However, availability of alternative devices poses a challenge. Key market players include Analog Devices Inc., AXT Inc., Broadcom Inc., CMK Ltd., DOWA Electronics Materials Co. Ltd., Edmund Optics Inc., Freiberger Compound Materials GmbH, Furukawa Denshi Co. Ltd., Hanergy Thin Film Power EME BV, II VI Inc., Logitech Ltd., MACOM Technology Solutions Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors NV, Qorvo Inc., Reade International Corp., Skyworks Solutions Inc., Sumitomo Electric Industries Ltd., Umicore SA, and Western Minmetals SC Corp.

Get a detailed analysis on regions, market segments, customer landscape, and companies- View the snapshot of this report

Gallium Arsenide Components Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 6.3%

Market growth 2024-2028

USD 3518.2 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

5.83

Regional analysis

APAC, North America, Europe, South America, and Middle East and Africa

Performing market contribution

APAC at 79%

Key countries

South Korea, China, US, India, and Taiwan

Key companies profiled

Analog Devices Inc., AXT Inc., Broadcom Inc., CMK Ltd., DOWA Electronics Materials Co. Ltd., Edmund Optics Inc., Freiberger Compound Materials GmbH, Furukawa Denshi Co. Ltd., Hanergy Thin Film Power EME BV, II VI Inc., Logitech Ltd., MACOM Technology Solutions Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors NV, Qorvo Inc., Reade International Corp., Skyworks Solutions Inc., Sumitomo Electric Industries Ltd., Umicore SA, and Western Minmetals SC Corp.

Market Driver

The global market for Gallium Arsenide (GaAs) components is poised for significant growth due to the widespread adoption of high-speed Internet connectivity. With the phase-out of 2G and 3G networks and the increasing focus on 4G and 5G technologies, the demand for GaAs components in smartphones, tablets, and other communication devices is expected to increase substantially. 5G technology, which is currently in development, will offer faster data speeds and improved performance, leading to higher sales volumes for GaAs components. Major countries, including the US, Japan, and South Korea, are expected to be early adopters of 5G technology, further boosting the market growth. 

The Gallium Arsenide components market is experiencing significant growth, with technologies such as telecommunications, optoelectronics, and military applications driving demand. The use of GaAs in high-frequency applications, like radio frequency (RF) and microwave technologies, is increasing due to its superior performance. The semiconductor industry is also investing in GaAs for its use in power electronics and solar cells. The increasing demand for GaAs components is also due to their high efficiency, excellent thermal conductivity, and high electron mobility. The market for GaAs components is expected to continue its upward trend in the coming years. 

Research report provides comprehensive data on impact of trend. For more details- Download a Sample Report

Market Challenges

The GaAs components market faces challenges from emerging alternatives such as GaN, SiGe, LDMOS, and CMOS devices. GaN and LDMOS are used in power amplifiers, while SiGe is preferred in low-noise applications. CMOS is gaining popularity in entry-level phones and is expected to expand into smartphones. High-power RF semiconductor devices demand substrates with high thermal conductivity, which GaAs cannot provide. GaN substrates are used instead for high-voltage applications. These factors are expected to limit the growth of the GaAs components market during the forecast period.The Gallium Arsenide components market faces several challenges in the semiconductor industry. The high cost of production and complexity in manufacturing are major hurdles. The demand for these components is increasing due to their superior properties in telecommunications, optoelectronics, and radio frequency applications. However, the competition from other semiconductor materials, such as silicon, is intense. The need for advanced technologies and processes to improve efficiency and reduce costs is crucial. Defects and impurities in the raw materials and manufacturing processes also pose challenges. The market requires continuous research and development to address these issues and maintain competitiveness.

For more insights on driver and challenges – Request a sample report!

Segment Overview 

This gallium arsenide components market report extensively covers market segmentation by

Type 1.1 LEC grown GaAs1.2 VGF grown GaAsApplication 2.1 Mobile devices2.2 Wireless communication2.3 OthersGeography 3.1 APAC3.2 North America3.3 Europe3.4 South America3.5 Middle East and Africa

1.1 LEC grown GaAs- The LEC-grown GaAs segment led the gallium arsenide components market in 2023, driven by advancements in wireless communication, satellite technology, and other wireless networks. This segment’s dominance is attributed to the semiconductor industry’s high usage of semi-insulating GaAs single crystals. Benefits such as scalability, effectiveness, temperature reduction, carbon content control, and good insulation properties make LEC-grown GaAs an attractive choice. These advantages, coupled with the expanding semiconductor sector, are expected to boost demand for LEC-grown GaAs and fuel market growth throughout the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2017-2021) – Download a Sample Report

Research Analysis

The Gallium Arsenide (GaAs) components market encompasses the production and supply of various optoelectronic devices and semiconductor ICs, including Laser Diodes, Light Emitting Diodes, and Microwave Integrated Circuits. These components find extensive applications in the Aerospace Industry, Electronics Industry, and Communications Industry, particularly in the development of 5G Networks and 5G Wireless Communication systems. GaAs is a preferred semiconductor material due to its superior electrical and optical properties, making it ideal for Power Amplifiers, Low Noise Amplifiers, Filters and Duplexers, RF Mixers, Switches, and other frequency-related components. Operating at various frequencies and with different voltage requirements, these components are manufactured using advanced technologies like Plasma Etching and VGF Technology. The wafer size used in the production process varies depending on the specific application and component design.

Learn and explore more about Technavio’s in-depth research reports

The global Front End of the Line Semiconductor Equipment Market is experiencing robust growth due to the increasing demand for advanced semiconductors in various industries. Concurrently, the global Semiconductor IP Market is expanding, driven by the need for efficient and cost-effective semiconductor design solutions. Additionally, the Magneto Resistive RAM (MRAM) Market is gaining traction as MRAM technology offers significant advantages in terms of speed, endurance, and power efficiency. These trends highlight the dynamic nature of the semiconductor industry, underscoring the critical role of innovative technologies in shaping the future of electronics.

Market Research Overview

The Gallium Arsenide (GaAs) components market encompasses the production and supply of semiconductor devices and related products based on Gallium Arsenide. These components are utilized in various applications such as radio frequency (RF) and power electronics, optoelectronics, and sensor technology. GaAs materials offer advantages like high electron mobility, high saturation velocity, and high electron velocity, making them suitable for high-frequency and high-power applications. The GaAs components market is driven by the increasing demand for wireless communication systems, solar energy conversion systems, and other advanced technologies. The market is expected to grow significantly due to the continuous research and development in the field of GaAs technology and the increasing adoption of GaAs-based devices in various industries.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TypeLEC Grown GaAsVGF Grown GaAsApplicationMobile DevicesWireless CommunicationOthersGeographyAPACNorth AmericaEuropeSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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IIFL Capital’s Maiden Late-Stage Private Equity Fund Announces First Close at ~ ₹500 Crore

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IIFL Capital’s Late-Stage Private Equity Fund targets a final close in excess of ₹1,000 crore within nine months from First CloseTwo transactions have already been committed with a pipeline of seven to eight deals under evaluation

MUMBAI, India, Oct. 22, 2026 /PRNewswire/ — IIFL Capital Asset Management Limited, the Asset Management arm of IIFL Capital, today announced that the IIFL Late-Stage Private Equity Fund, the maiden fund of its private equity platform, achieved its first close on 15 September 2026 with aggregate capital commitments of ~ ₹500 crore. The Fund invests in scaled-up, profitable Indian enterprises that are preparing to list on the public markets in the near term.

The Fund is targeting a total corpus of ₹1,000 crore, with a greenshoe option of additional ₹1,000 crore. It will remain open for subscription after the first close and aims to reach its final close within the next nine months. A larger corpus allows the Fund to back high-quality companies operating on a scale, in line with its late-stage, pre-IPO strategy.

The Fund is also evaluating a robust pipeline of opportunities, ranging from term sheet negotiations to transactions under diligence. The pipeline is diversified across integrated security-as-a-service, railway and wind energy components, specialty chemicals, defence equipment, IT-enabled services, pre-engineered buildings and consumer technology.

The Fund follows a clear mandate focused on scaled businesses nearing a public listing. The fund looks at sectors that envisage growth rate of 15%-18% per annum. The investee company should be amongst the top three-five players in its category, should have an EBITDA of at least ₹75-100 crore at investment with the intention to pursue IPO within three years. The average deal size is expected to be ₹50-100 crore per transaction.

Commenting on the milestone, Mr. Deepak Mittal, Chief Investment Officer and Head – Private Equity, IIFL Capital Asset Management Limited, said: “The first close marks the point at which this Fund moves from being a proposition to being a portfolio. We are grateful to our investors for their confidence in a volatile global environment. With two high-quality transactions already committed and a live pipeline of seven to eight opportunities, we believe IIFL’s capabilities give us a distinct advantage in backing scaled enterprises on their journey to the public markets.”

The first close comes in the backdrop of India’s primary market revival. After a subdued April-June quarter, July and August 2026 together saw 35 mainboard IPOs, and foreign portfolio investors returned as net buyers, including through IPOs. Real GDP grew 7.8% in Q1 FY27, with gross fixed capital formation up 11.9%, supporting the sectors the Fund is targeting.

About IIFL Capital Asset Management Limited

IIFL Capital Asset Management Limited (formerly IIFL Securities Alternate Asset Management Limited) is the Investment Manager for Alternative Investment Funds sponsored by IIFL Capital Services Limited. It is registered with SEBI as an Alternative Investment Fund manager (IN/AIF3/19-20/0770, IN/AIF2/21-22/088), Investment Adviser (INA000019956) and Portfolio Manager (INP000009445). Registered office: Ground Floor 01, Hubtown Solaris, Saiwadi, N S Phadke Road, Andheri East, Mumbai 400069. Website: assetmanagement.iiflcapital.com

About IIFL Capital Services Ltd

IIFL Capital Services Ltd (formerly known as IIFL Securities Limited) (NSE: IIFLCAPS) (BSE: 542773) is one of the key capital market players in the Indian financial services space. IIFL Capital offers broking services, wealth management, financial products distribution, institutional broking, research and investment banking services.

Disclaimer: This press release is for information purposes only and does not constitute an offer to sell or a solicitation of an offer to buy any units of the IIFL Late-Stage Private Equity Fund or any securities. Investments in alternative investment funds are subject to market and other risks, including loss of capital. Investors should read the Private Placement Memorandum, including the risk factors, before investing. Registration granted by SEBI, enlistment with BSE, and certification from NISM in no way guarantee performance of the intermediary or provide any assurance of returns to investors. Past performance of securities/instruments is not indicative of their future performance.

 

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Snapmaker Introduces New Filament Bundle, Expanding Its Full Spectrum Printing Ecosystem

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The Snapmaker PLA Full Spectrum Filament Bundle (White Edition) combines pure-white capability, more saturated cyan, magenta, and yellow filaments, and finely tuned light-transmission properties for vibrant, natural-looking color mixes. It expands Snapmaker’s integrated ecosystem of dedicated materials, Snapmaker Orca software, and U1 hardware.

SHENZHEN, China, Oct. 22, 2026 /PRNewswire-PRWeb/ — Snapmaker has introduced the Snapmaker PLA Full Spectrum Filament Bundle (White Edition), expanding the creative possibilities of layered color mixing on Snapmaker U1. The four-spool set combines semi-translucent cyan, magenta, yellow, and white PLA filaments to produce a broader palette, from vivid color mixes and soft pastels to directly printed pure-white details.

“Together with the reformulated color filaments, the addition of white opens up a broader range of visual styles.” — Blayne Sapelli, Creative Marketing Manager at Snapmaker.

Four Filaments, Beyond Four Colors

Full Spectrum color mixing creates additional perceived colors by alternating thin layers of semi-translucent filaments along the Z-axis. As light interacts with these layers, their colors blend visually, allowing a single print to go beyond the four loaded filament colors.

Snapmaker Orca, Snapmaker’s official slicing software, supports this layered color mixing workflow. Together with U1’s multi-toolhead architecture, it provides a practical foundation for exploring more colors with a small set of materials.

Radu “Ratdoux,” creator of Full Spectrum and now part of the Snapmaker team, said: “Full Spectrum changes the way we think about color in consumer FDM printing. Instead of adding more and more individual filament colors, we can use a small set of calibrated materials together with software and multi-toolhead hardware to generate a much broader spectrum. Our goal is to make that process simple enough that users can focus on what they want to create rather than how to engineer the color.”

Filaments Engineered for Brighter Color

White filament brings two distinct benefits: it enables pure-white areas that layered color mixing alone cannot produce, and it brightens mixed colors while reducing saturation for lighter, softer tones. Reformulated cyan, magenta, and yellow filaments offer stronger saturation, helping deliver more vibrant mixes.

The filaments’ color and Transmission Distance properties are tuned to promote natural blending and help reduce visible horizontal stripes. On Snapmaker U1, RFID recognition automatically loads preset filament information, simplifying setup.

These properties give creators more flexibility to combine vivid accents, gentle shades, and white details in character models, collectibles, home décor, and sculptural artwork. The four-spool approach also reduces the need to store separate filament colors for occasional use.

“Adding white is a meaningful step for creators who want lighter palettes and pure-white details within the same four-spool setup,” said Blayne Sapelli, Creative Marketing Manager at Snapmaker, “Together with the reformulated color filaments, it opens up a different range of visual styles. It also reflects how we are building our ecosystem: developing dedicated materials around real creative needs and connecting them with the tools people use to print.”

An Integrated Ecosystem for Color Creation

The Snapmaker PLA Full Spectrum Filament Bundle (White Edition) joins the Snapmaker PLA Full Spectrum Filament Bundle (Gray Edition) and the SnapSpeed PLA CMYK Lithophane Filament Bundle, expanding Snapmaker’s official lineup to three purpose-designed bundles.

The two PLA Full Spectrum bundles are designed for three-dimensional color mixing. The new bundle enables brighter mixes, softer pastels, and pure-white details, while the Gray Edition offers darker, more muted tones. The CMYK Lithophane bundle is optimized for flat, layered-color printing, including colorful backlit lithophanes made from photographs and illustrations.

Built around U1 and Snapmaker Orca, the lineup connects specialized materials with hardware and software support.

Pricing and Product Information

The bundle is priced at US$89 and contains four 1 kg spools, totaling 4 kg. For product details and regional purchasing information, visit the official product page.

About Snapmaker

Snapmaker makes products that empower everyone to change the world — literally. From 3-in-1 desktop fabrication machines to the Snapmaker U1 multicolor, multimaterial, toolchanger 3D printer, to the software that powers it all, Snapmaker is building an ecosystem that democratizes creation. Snapmaker: Make Something Wonderful.

For more information, visit Snapmaker.com.

Media Contact

Hao Jiang, Snapmaker, 86 13588745216, jianghao@snapmaker.com, www.snapmaker.com

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SOURCE Snapmaker

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Today, Intelligent Legal Solutions (ILS) and Anduin announced a partnership to provide a more streamlined service for both fund managers and law firms

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PALO ALTO, Calif., Oct. 22, 2026 /PRNewswire/ — Intelligent Legal Solutions (ILS) and Anduin have announced a partnership to create a more connected fundraising experience for private markets fund managers and law firms.

ILS is the legal technology company behind ProVision, a platform for private investment funds lawyers and their clients, while Anduin provides technology for private markets fundraising and investor operations. Through the partnership, the companies will build an integration connecting their platforms to support a more streamlined, end-to-end fundraising process.

Launched in 2024, ILS works with 89% of law firms ranked in the top three bands by Chambers USA for Private Equity: Fund Formation nationwide. Its technology has supported fundraises totaling more than $825 billion across North America, the UK, EMEA and APAC.

Anduin’s platform has supported more than 1,300 private investment funds, onboarded over 76,000 investors and powered more than $265 billion in capital raised. Its customers represent more than $7 trillion in aggregate assets under management.

Fergus Plant, Co-Founder of ILS, said: “We are hugely excited to announce our partnership with Anduin. They are a mainstay of the private markets tech space, and we are proud to collaborate to bring a more complete solution to our customers. Our recent launch of the Fund Manager Portal for ProVision more closely aligns our customers, deepening the benefits of this relationship.”

Eliot Hodges, CEO of Anduin, said: “Fundraising still involves too many handoffs between systems, teams and advisers. By connecting Anduin’s subscription and investor onboarding workflows with ProVision’s side letter, comment memo, MFN and obligation management capabilities, we can help firms carry data more seamlessly through the fundraising process and reduce the operational burden around close.”

Read more at https://anduintransact.com/blog/anduin-partners-with-ils 

Fund managers and law firms interested in learning more can contact:

About Anduin
Anduin is the leading digital platform for managing fund lifecycles and LP relationships. The company has facilitated $118 billion in global capital and supports 48,000+ investors across 890+ funds. Learn more at anduintransact.com.

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SOURCE Anduin Transactions

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