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Advanced Packaging Market to Reach $119.4 Billion, Globally, by 2032 at 10.6% CAGR: Allied Market Research

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The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. 

Wilmington, Del., Aug. 7, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Advanced Packaging Market by Type (Flip chip CSP, Flip-chip ball grid array, Wafer level CSP, 2.5D/3D, Fan-out WLP and Others), End user (Consumer electronics, Automotive, Industrial, Healthcare, Aerospace & defense and Others), By (): Global Opportunity Analysis and Industry Forecast, 2024-2032″. According to the report, the advanced packaging market was valued at $48.5 billion in 2023, and is estimated to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.

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(We are providing report as per your research requirement, including the Latest Industry Insight’s Evolution, Potential and COVID-19 Impact Analysis)

130 – Tables58 – Charts250 – Pages

Prime Determinants of Growth 

The notable factors positively affecting the advanced packaging market include increasing demand for miniaturization of devices and improved system performance and optimization of advanced packaging. However, problems regarding the high cost of advanced packaging technology hamper market growth. Moreover, emerging trends toward fan-out wafer level packaging are expected to offer huge opportunities for the advanced packaging market. 

Report Coverage & Details: 

Report Coverage 

Details 

Forecast Period 

2024–2032 

Base Year 

2023

Market Size in 2023 

$48.5 billion 

Market Size in 2032 

$119.4 billion 

CAGR 

10.6 %

No. of Pages in Report 

250

Segments Covered 

Type, End User, and Region. 

Drivers 

Increasing demand for miniaturizationGrowth in consumer electronics The expansion of IoT applications across various sectors, including industrial, healthcare, and smart homes 

Opportunities 

The growing adoption of electronic components in automotive applications Growth in Data Centers and Cloud Computing 

Restraint 

High costs associated with advanced packaging 

Segment Highlights

The demand for CSP flip chip ball grid array segment in advanced packaging market is driven by its superior performance characteristics, essential for high-performance and compact electronic devices. FCBGA technology offers excellent electrical and thermal performance, allowing for higher interconnection density, improved signal integrity, and efficient heat dissipation. These features are critical for applications in high-performance computing, mobile devices, and consumer electronics. The increasing demand for miniaturization, enhanced processing power, and energy efficiency in these devices fuel the growth of CSP FCBGA packaging solutions, meeting the evolving requirements of advanced semiconductor applications. 

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The demand for the consumer electronics segment in the advanced packaging market is on the rise due to the increasing need for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. Advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV) enable miniaturization, improved power efficiency, and enhanced functionality, which are essential for modern consumer electronics. The rapid adoption of technologies such as 5G, IoT, and AI in these devices further drives the need for sophisticated packaging solutions that support higher processing speeds, better heat dissipation, and greater interconnection density, thus fueling market growth.

Regional Outlook 

In Asia-pacific, China attained the highest market share in the advanced packaging market due to strong semiconductor manufacturing infrastructure, substantial investments in research and development, and a strong focus on technological innovation. China is home to major semiconductor foundries and packaging companies that drive advancements in packaging technologies. In addition, the high demand for consumer electronics, automotive electronics, and telecommunication devices in the domestic market fuels the need for advanced packaging solutions. Government support through favorable policies and initiatives to boost the semiconductor industry further propels China’s leadership position in the advanced packaging market. 

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Key Players: – 

Amkor TechnologyIntel CorporationQualcomm Technologies Inc.Taiwan Semiconductor Manufacturing CompanyIBMMicrochip TechnologyRenesas Electronics CorporationTexas InstrumentsAnalog Devices

The report provides a detailed analysis of these key players in the global advanced packaging market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Recent Development: 

In October 2023, Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to enhance advanced package architecture across its VIPack platform. This innovative approach facilitates a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory, for integration using 2.5D or advanced fanout structures. The IDE is designed to systematically boost the efficiency and effectiveness of advanced packaging, supporting the evolving demands of semiconductor technology. 

Key Benefits For Stakeholders:

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the advanced packaging market analysis from 2024 to 2032 to identify the prevailing advanced packaging market opportunities.The market research is offered along with information related to key drivers, restraints, and opportunities.Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.In-depth analysis of the advanced packaging market segmentation assists to determine the prevailing market opportunities.Major countries in each region are mapped according to their revenue contribution to the global market.Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.The report includes the analysis of the regional as well as global advanced packaging market trends, Advanced Packaging Company List,  Advanced Packaging Market Share by Companies,   Advanced Packaging Industry Report,  Advanced Packaging Sector Analysis,  Semiconductor Advanced Packaging,  Advanced Packaging Technology key players, market segments, application areas, and market growth strategies.

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Advanced Packaging Market Key Segments:

By Type

Flip chip CSPFlip-chip ball grid arrayWafer level CSP2.5D/3DFan-out WLPOthers

By End User

Consumer electronicsAutomotiveIndustrialHealthcareAerospace & defenseOthers

By Region:

North America (U.S., Canada, and Mexico)Europe (UK, Germany, France, Russia, and Rest of Europe)Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia-Pacific)Latin America (Brazil, Argentina, and Rest of Latin America)Middle East and Africa (UAE, Saudi Arabia, and Rest of Middle East and Africa)

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Trending Reports in Semiconductor and Electronics Industry:

Semiconductor Packaging Market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030

Consumer Electronics Packaging Market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032

Quad-Flat-No-Lead Packaging Market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031

Embedded Die Packaging Technology Market was valued at $69.2 million in 2021, and is projected to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031

Wafer Level Packaging Market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030.

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports Insights” and “Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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BinBase Launches 2026 BIN Database Featuring 6-11 Digit Waterfall Lookup for High-Precision Payment Routing

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BinBase introduces its upgraded 2026 BIN Database, offering 3.2M+ card ranges, 29 granular data attributes, and extended 8-11 digit accuracy to eliminate false-positives and optimize routing for global fintechs.

MIAMI, July 21, 2026 /PRNewswire-PRWeb/ — BinBase, a provider of payment intelligence and card issuing data, has announced the official release of its updated 2026 BIN Database. Engineered for payment gateways, acquiring banks, fraud prevention platforms, and e-commerce platforms, the updated dataset solves critical routing inaccuracies caused by the industry-wide shift from legacy 6-digit BINs to extended 8-to-11-digit card ranges.

Relying solely on 6-digit BINs in 2026 means misclassifying card products and losing money on interchange fees. Our 2026 release provides the surgical precision developers need for cost-effective payment routing.

Since ISO/IEC 7812 expanded the standard Bank Identification Number (BIN) length to 8 digits, traditional 6-digit lookup tables have struggled to correctly identify modern card profiles. This leads to false positives, misidentified interchange fees, and failed transactions. BinBase addresses this challenge by introducing a multi-tiered database structure supporting up to 11-digit precision, alongside a recommended “Waterfall Lookup Algorithm.”

To ensure 100% routing and verification accuracy, the Waterfall method executes a descending search sequence: checking 11-digit BIN ranges down through 10, 9, 8, 7, and 6 digits until an exact match is resolved.

Key technical specifications of the 2026 BinBase release include:

Over 3.2 Million Card Ranges: Full global coverage including Visa, Mastercard, Amex, Discover, UnionPay, JCB, and regional networks.Extended Precision: Over 88% of the dataset consists of high-precision ranges (8–11 digits) to accurately isolate sub-brands, currencies, and card tiers.29 Granular Attributes: Beyond core issuer data, the database features advanced parameters including Durbin Regulation status, US Debit/ATM network routing (STAR, NYCE), Fast Funds (Visa Direct / Mastercard MoneySend indicators), commercial Level 2/Level 3 data, and digital wallet token ranges (Apple Pay / Google Pay).

“Modern payment processing requires surgical precision,” said a spokesperson for Damiko Inc. “Relying solely on 6-digit BINs in 2026 means misclassifying card products and losing money on interchange fees. Our 2026 release provides the underlying intelligence developers need to build resilient, cost-effective payment infrastructure.”

Developers and payment teams can evaluate the full 29-field database schema, review integration examples, and download a free 2026 sample dataset on the official GitHub repository.

To learn more about full commercial licensing options, instant CSV downloads, and custom API delivery, visit BinBase.

About Damiko Inc

Damiko Inc is a US-based fintech data provider specializing in card issuer analytics, payment routing data, and global BIN database solutions. Operating through its flagship product, BinBase.com, the company supplies high-precision transaction intelligence to help merchants and payment facilitators worldwide optimize approval rates and mitigate fraud.

Media Contact

Fedor Lavrikoff, BinBase, 1 +17866133333, sales@binbase.com, htttps://www.binbase.com 

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SOURCE BinBase

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Redington Limited and AutomationEdge Announce Strategic Partnership to Accelerate Enterprise Automation and Agentic AI Adoption

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MUMBAI, India, July 22, 2026 /PRNewswire/ — Redington, a leading technology aggregator and innovation catalyst, and AutomationEdge, a leading Agentic Process Automation platform for global enterprises, have announced a strategic partnership to accelerate the adoption of enterprise automation and Agentic AI. The collaboration brings together Redington’s extensive distribution ecosystem and partner network with AutomationEdge’s enterprise-grade Agentic Process Automation platform to enable faster, scalable, and outcome-driven digital transformation for organizations.

As a part of the partnership, AutomationEdge’s portfolio of AI Agents and automation solutions is now available through the Redington AI Exchange Marketplace, enabling partners and customers to easily discover, evaluate, and deploy enterprise-ready AI solutions. This availability significantly reduces the time required to adopt AI-driven automation and provides organizations with access to proven use cases that can deliver measurable business outcomes.

The partnership is focused on delivering solution-led automation offerings that simplify adoption for enterprises and channel partners. By combining Redington’s go-to-market reach with AutomationEdge’s 10x automation capabilities, the two organizations aim to help businesses move from fragmented automation initiatives to enterprise-wide orchestration—driving efficiency, agility, and operational excellence.

Through this collaboration, both companies will jointly promote pre-built automation and AI Agent solutions across key business functions, including banking operations, insurance processes, IT / HR operations, customer service, and finance functions. These solutions include ready-to-deploy workflows, AI Agents, demonstration environments, and implementation frameworks designed to accelerate deployment and reduce complexity.

The partnership will also include joint go-to-market initiatives such as partner enablement programs, co-branded workshops, solution showcases, and proof-of-concept (PoC) engagements. These initiatives are designed to equip Redington partners with the knowledge, tools, and support needed to successfully position, sell, and implement AI-powered automation solutions for enterprise and mid-market customers.

Sayantan Dev, Global Head, Software Solutions Group, Redington, said, “The next phase of AI adoption will be defined by execution. Through the Redington AI Exchange Marketplace, we are bringing together the technologies and ecosystem needed to help partners deliver real business outcomes at scale. AutomationEdge’s Agentic AI and automation capabilities strengthen our ability to enable customers to accelerate AI adoption with greater speed, governance, and confidence.”

Prasad Likhite, Chief Sales Officer of AutomationEdge, said, “We are delighted to strengthen our partnership with Redington and accelerate the adoption of next-generation enterprise automation and Agentic AI solutions across the market. The availability of AutomationEdge AI Agents through the Redington AI Exchange Marketplace marks an important milestone in democratizing AI-led transformation, enabling enterprises to rapidly scale intelligent automation initiatives with speed, agility, and measurable business impact. At the same time, it creates significant opportunities for partners to drive innovation, unlock new revenue streams, and deliver greater value to their customers.”

The collaboration also emphasizes localized support, implementation expertise, and customer success services, ensuring that organizations can seamlessly deploy, manage, and scale automation initiatives. By leveraging Redington’s strong partner ecosystem and AutomationEdge’s deep expertise in automation and Agentic AI, the partnership is well-positioned to address the evolving needs of modern enterprises.

As organizations increasingly prioritize productivity, operational efficiency, and AI-led transformation, this partnership marks a significant step toward making enterprise automation and Agentic AI more accessible, scalable, and impactful across industries.

 About Redington

Redington Limited (NSE: REDINGTON) (BSE: 532805), a leading technology solutions provider, empowers businesses in their digital transformation journeys. Guided by its brand narrative “Unlock Next”, Redington goes beyond distribution to remove barriers, accelerate digital adoption, and unlock access, growth, trust, efficiency, and impact—helping businesses, communities, and societies embrace what’s next in technology

About AutomationEdge

AutomationEdge is a leading Agentic Process Automation platform for global enterprises. Its platform enables organizations to automate complex business processes, deploy AI Agents at scale, improve operational efficiency, and accelerate digital transformation initiatives across industries.

Media Contact:
Rahul Wandile
rahul.wandile@automationedge.com

 

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Applied Intuition Launches Dana, the Agentic Platform for Physical AI

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New platform pairs agentic AI with the tooling, data, infrastructure and domain expertise Applied Intuition has built over nearly a decade to speed the safe development of intelligent machines for the physical world.

Dana is the first agentic platform for building, testing, deploying and operating physical AI systems across industries.Built on nearly a decade of Applied Intuition’s tooling, infrastructure, workflows and engineering expertise, Dana is purpose-built for safety-critical systems operating in the physical world.Dana helps companies build physical AI applications for any industry or use case, from autonomy and software-defined vehicles to fleet operations, robotics, construction, mining and intelligent in-vehicle experiences.Dana has already reduced critical phases of vehicle development from months to days in internal and select customer deployments.

SUNNYVALE, Calif., July 22, 2026 /PRNewswire/ — Applied Intuition, Inc., a leader in physical AI, today announced the launch of Dana, the first agentic platform for building, testing, deploying and operating physical AI systems across industries. Dana combines the power of agentic AI and rapid application development with nearly a decade of Applied Intuition’s tooling, infrastructure and engineering knowledge. The result is a unified system that accelerates the development of intelligent machines in the physical world.

“We believe physical AI will become one of the defining technologies of this century,” said Qasar Younis, co-founder and CEO of Applied Intuition. “Our ambition is to help bring intelligence to a billion machines, and Dana is the platform we built to make that possible.”

Unlike general-purpose AI tools designed primarily for digital workflows, Dana is built for the complexities of machines operating in the physical world. Dana comes with all the platform capabilities needed to build and deploy safety-critical physical AI applications, including data, visualization and tooling, as well as the evaluation, traceability and governance these systems require. The platform was designed to work across industries and with a wide range of use cases, from software-defined vehicle development and advanced driver assistance systems (ADAS) to mining and construction operations, truck fleet management, robotics and intelligent in-vehicle experiences. With Dana, customers can:

Deploy Applied Intuition’s reference applications — spanning autonomy, fleet operations, and more — or build their own.Use both natural language and command-line interfaces to complete complex development tasks more intuitively and accelerate iteration cycles across teams and systems.Integrate the platform with enterprise systems and collaboration tools, like Slack and Jira, helping organizations connect fragmented engineering and operational workflows while embedding agentic capabilities across the development process.

Applied Intuition has used Dana internally since last year, building and delivering solutions on the platform for long-standing customers across automotive, trucking, mining, and agriculture. Dana’s agent-driven workflows have reduced critical phases of vehicle development timelines from months to days in some cases. Applied Intuition has offered limited, early access to select customers, including heavy-equipment manufacturer Komatsu and Isuzu Motors, who is using the platform to accelerate L4 autonomy for its fleet of commercial trucks.

“We’ve been impressed by how Dana can streamline complex engineering workflows and accelerate development,” said Yasuhiro Yazawa, Director, Isuzu Motors Limited, Japan. “Dana gives our engineering teams greater confidence to develop, track and deploy safe autonomous-vehicle capabilities at a much faster pace.”

“Applied Intuition has been a valuable technology partner as we continue advancing the digital capabilities that support the next generation of mining equipment and solutions,” said Peter Salditt, CEO, Komatsu Mining. “Dana represents another step forward, bringing intelligent, agentic capabilities into our engineering workflows to help our teams innovate faster, improve efficiency and ultimately create greater value for our customers’ operations.”

Dana is designed to help companies keep up with the fundamental shift now underway across industries. As autonomous vehicles, robots and industrial systems become more capable, manufacturers need a more integrated way to build, validate and deploy them safely. Dana gives teams a faster path from idea to production, and the confidence to put increasingly intelligent machines into the real world.

The future of AI is physical. Dana was built for it.

To learn more about Dana and Applied Intuition’s physical AI platform, visit AppliedIntuition.com.

About Applied Intuition
Applied Intuition, Inc. is powering the future of physical AI. Founded in 2017 and now valued at $15 billion, the Silicon Valley company is creating the digital infrastructure needed to bring intelligence to every moving machine on the planet. Applied Intuition services the automotive, defense, trucking, construction, mining and agriculture industries in three core areas: tools and infrastructure, operating systems, and autonomy. Eighteen of the top 20 global automakers, as well as the United States military and its allies, trust the company’s solutions to deliver physical intelligence. Applied Intuition is headquartered in Sunnyvale, California, with nearly two dozen offices across the globe, including in London, Munich, Tokyo, Seoul, and the Washington, D.C. metro area. Learn more at applied.co or press@applied.co.

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SOURCE Applied Intuition, Inc.

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