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Advanced Packaging Market to Reach $119.4 Billion, Globally, by 2032 at 10.6% CAGR: Allied Market Research

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2 years ago

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The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. 

Wilmington, Del., Aug. 7, 2024 /PRNewswire/ — Allied Market Research published a report, titled, “Advanced Packaging Market by Type (Flip chip CSP, Flip-chip ball grid array, Wafer level CSP, 2.5D/3D, Fan-out WLP and Others), End user (Consumer electronics, Automotive, Industrial, Healthcare, Aerospace & defense and Others), By (): Global Opportunity Analysis and Industry Forecast, 2024-2032″. According to the report, the advanced packaging market was valued at $48.5 billion in 2023, and is estimated to reach $119.4 billion by 2032, growing at a CAGR of 10.6% from 2024 to 2032.

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(We are providing report as per your research requirement, including the Latest Industry Insight’s Evolution, Potential and COVID-19 Impact Analysis)

130 – Tables58 – Charts250 – Pages

Prime Determinants of Growth 

The notable factors positively affecting the advanced packaging market include increasing demand for miniaturization of devices and improved system performance and optimization of advanced packaging. However, problems regarding the high cost of advanced packaging technology hamper market growth. Moreover, emerging trends toward fan-out wafer level packaging are expected to offer huge opportunities for the advanced packaging market. 

Report Coverage & Details: 

Report Coverage 

Details 

Forecast Period 

2024–2032 

Base Year 

2023

Market Size in 2023 

$48.5 billion 

Market Size in 2032 

$119.4 billion 

CAGR 

10.6 %

No. of Pages in Report 

250

Segments Covered 

Type, End User, and Region. 

Drivers 

Increasing demand for miniaturizationGrowth in consumer electronics The expansion of IoT applications across various sectors, including industrial, healthcare, and smart homes 

Opportunities 

The growing adoption of electronic components in automotive applications Growth in Data Centers and Cloud Computing 

Restraint 

High costs associated with advanced packaging 

Segment Highlights

The demand for CSP flip chip ball grid array segment in advanced packaging market is driven by its superior performance characteristics, essential for high-performance and compact electronic devices. FCBGA technology offers excellent electrical and thermal performance, allowing for higher interconnection density, improved signal integrity, and efficient heat dissipation. These features are critical for applications in high-performance computing, mobile devices, and consumer electronics. The increasing demand for miniaturization, enhanced processing power, and energy efficiency in these devices fuel the growth of CSP FCBGA packaging solutions, meeting the evolving requirements of advanced semiconductor applications. 

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The demand for the consumer electronics segment in the advanced packaging market is on the rise due to the increasing need for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. Advanced packaging technologies like Fan-Out Wafer-Level Packaging (FOWLP) and Through-Silicon Via (TSV) enable miniaturization, improved power efficiency, and enhanced functionality, which are essential for modern consumer electronics. The rapid adoption of technologies such as 5G, IoT, and AI in these devices further drives the need for sophisticated packaging solutions that support higher processing speeds, better heat dissipation, and greater interconnection density, thus fueling market growth.

Regional Outlook 

In Asia-pacific, China attained the highest market share in the advanced packaging market due to strong semiconductor manufacturing infrastructure, substantial investments in research and development, and a strong focus on technological innovation. China is home to major semiconductor foundries and packaging companies that drive advancements in packaging technologies. In addition, the high demand for consumer electronics, automotive electronics, and telecommunication devices in the domestic market fuels the need for advanced packaging solutions. Government support through favorable policies and initiatives to boost the semiconductor industry further propels China’s leadership position in the advanced packaging market. 

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Key Players: – 

Amkor TechnologyIntel CorporationQualcomm Technologies Inc.Taiwan Semiconductor Manufacturing CompanyIBMMicrochip TechnologyRenesas Electronics CorporationTexas InstrumentsAnalog Devices

The report provides a detailed analysis of these key players in the global advanced packaging market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.

Recent Development: 

In October 2023, Advanced Semiconductor Engineering Inc. (ASE) announced the launch of its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to enhance advanced package architecture across its VIPack platform. This innovative approach facilitates a seamless transition from single-die SoC to multi-die disaggregated IP blocks, including chiplets and memory, for integration using 2.5D or advanced fanout structures. The IDE is designed to systematically boost the efficiency and effectiveness of advanced packaging, supporting the evolving demands of semiconductor technology. 

Key Benefits For Stakeholders:

This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the advanced packaging market analysis from 2024 to 2032 to identify the prevailing advanced packaging market opportunities.The market research is offered along with information related to key drivers, restraints, and opportunities.Porter’s five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.In-depth analysis of the advanced packaging market segmentation assists to determine the prevailing market opportunities.Major countries in each region are mapped according to their revenue contribution to the global market.Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.The report includes the analysis of the regional as well as global advanced packaging market trends, Advanced Packaging Company List,  Advanced Packaging Market Share by Companies,   Advanced Packaging Industry Report,  Advanced Packaging Sector Analysis,  Semiconductor Advanced Packaging,  Advanced Packaging Technology key players, market segments, application areas, and market growth strategies.

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Advanced Packaging Market Key Segments:

By Type

Flip chip CSPFlip-chip ball grid arrayWafer level CSP2.5D/3DFan-out WLPOthers

By End User

Consumer electronicsAutomotiveIndustrialHealthcareAerospace & defenseOthers

By Region:

North America (U.S., Canada, and Mexico)Europe (UK, Germany, France, Russia, and Rest of Europe)Asia-Pacific (China, Japan, India, Australia, South Korea, and Rest of Asia-Pacific)Latin America (Brazil, Argentina, and Rest of Latin America)Middle East and Africa (UAE, Saudi Arabia, and Rest of Middle East and Africa)

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Trending Reports in Semiconductor and Electronics Industry:

Semiconductor Packaging Market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030

Consumer Electronics Packaging Market was valued at $22.1 billion in 2022, and is projected to reach $49.1 billion by 2032, growing at a CAGR of 8.4% from 2023 to 2032

Quad-Flat-No-Lead Packaging Market size was valued at $453.1 million in 2021, and is projected to reach $1.1 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031

Embedded Die Packaging Technology Market was valued at $69.2 million in 2021, and is projected to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031

Wafer Level Packaging Market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030.

About Us:

Allied Market Research (AMR) is a full-service market research and business-consulting wing of Allied Analytics LLP based in Wilmington, Delaware. Allied Market Research provides global enterprises as well as medium and small businesses with unmatched quality of “Market Research Reports Insights” and “Business Intelligence Solutions.” AMR has a targeted view to provide business insights and consulting to assist its clients to make strategic business decisions and achieve sustainable growth in their respective market domain.

We are in professional corporate relations with various companies, and this helps us in digging out market data that helps us generate accurate research data tables and confirms utmost accuracy in our market forecasting. Allied Market Research CEO Pawan Kumar is instrumental in inspiring and encouraging everyone associated with the company to maintain high quality of data and help clients in every way possible to achieve success. Each and every data presented in the reports published by us is extracted through primary interviews with top officials from leading companies of domain concerned. Our secondary data procurement methodology includes deep online and offline research and discussion with knowledgeable professionals and analysts in the industry.

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“What If We Had This in 2020?” Data Viz 4 Good Bridges the Fortune 100 Data Gap for the Social Sector

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May 5, 2026

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SAN FRANCISCO, May 5, 2026 /PRNewswire/ — Data Viz 4 Good (DV4G) today announced the launch of its ImpactIQ platform, a breakthrough SaaS solution transforming how the social sector visualizes mission-critical data.

For founders Tyra Jean and Vanessa Francesca Ortega, both Ronald E. McNair Baccalaureate Scholars, the mission began with a pivotal question: “What if we had Data Viz 4 Good at Syracuse University back in 2020?”

CEO Tyra Jean—a former Public Policy & International Affairs Fellow at UC Berkeley and current D.S.W. candidate at the University of Southern California—developed the concept after bridging two vastly different worlds. “I worked as a data consultant for Fortune 100 companies and saw firsthand the massive gap in data infrastructure across the nonprofit sector,” said Jean. “We’re bringing enterprise-grade technology to the organizations that need it most.”

This vision, combined with the duo’s technical pedigree, has positioned them as emerging leaders in the next generation of AI-powered social infrastructure and frontrunners for Forbes’ 30 Under 30.

The platform’s technical moat is anchored by the COO Vanessa Francesca Ortega — Posse Alumni, SU Remembrance Scholar, and Newhouse’s Dean Branham Scholar. She is the founder & CEO of Civic Trust Systems, the core operating system powering municipal-scale AI platforms, including HellogovAI Inc.

“ImpactIQ is built on infrastructure originally designed to power secure, large-scale government service delivery,” said Ortega. “Through Civic Trust Systems, I developed the AI delivery model and user experience architecture that enables platforms like Hellogov. We are now applying that same level of security and privacy to the social sector.”

By leveraging Civic Trust Systems, DV4G delivers government-grade security, privacy-first data handing, and scalable AI intelligence— without the complexity of cost of traditional enterprise systems.

As a free resource for the sector, the founders co-host a DV4G Podcast on Instagram (@DataViz4GoodHQ). The next episode explores how ImpactIQ’s privacy-first architecture not only protects sensitive community data but also strengthens grant readiness and institutional trust.

DV4G is currently scaling ImpactIQ for global researchers, nonprofits, and mission-driven organizations seeking to modernize how they measure and communicate impact.

Unlock the full impact of your data at DataViz4Good.org.

Media inquiries: contact@dataviz4good.org

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SOURCE Data Viz 4 Good

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QuickLogic to Showcase EOS™ S3 and eFPGA Solutions at Sensors Converge

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39 minutes ago

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May 5, 2026

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SAN JOSE, Calif., May 5, 2026 /PRNewswire/ — QuickLogic Corporation (NASDAQ: QUIK) will showcase its EOS™ S3 SoC and eFPGA solutions at Sensors Converge 2026, taking place at the Santa Clara Convention Center. Attendees can visit Booth 1039 to see how developers can build always-on, ultra-low power sensor and voice-enabled systems with greater flexibility and faster time-to-market.

At the booth, QuickLogic will highlight the EOS™ S3, a fully integrated platform designed for concurrent voice, motion, environmental, and biometric sensing. With its built-in low-power sound detection, Arm® Cortex®-M4F processor, and embedded FPGA, the EOS™ S3 enables developers to implement custom hardware acceleration while minimizing power consumption—ideal for battery-operated and always-on applications.

Date: May 6 and 7, 2026

Booth: 1039

Exhibit Hours:

Wednesday, May 6: 10:00 AM – 5:30 PMThursday, May 7: 10:00 AM – 4:00 PM

About QuickLogic
QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions. QuickLogic’s unique approach combines cutting-edge technology with open-source tools to deliver highly customizable, low-power solutions for aerospace and defense, industrial, computing, and consumer markets. For more information, visit www.quicklogic.com.

QuickLogic and logo are registered trademarks of QuickLogic. All other trademarks are the property of their respective holders and should be treated as such.

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SOURCE QuickLogic Corporation

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PIRELLI WILL START CYBER™ TYRE PRODUCTION IN GEORGIA UNDERLINING THE STRATEGIC IMPORTANCE OF THE U.S. MARKET

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40 minutes ago

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May 5, 2026

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Pirelli further strengthens its commitment to the country. Investment and output expansion details will be communicated in the coming months following the finalization of the development plans

MILAN and WASHINGTON, May 5, 2026 /PRNewswire/ — Pirelli is reinforcing its long-term commitment to the United States with a key step in its product and industrial strategy. The Georgia plant, already dedicated to the most technologically advanced products for the U.S. market—both in the High-Value segment and in Motorsport—will be further enhanced by the production of connected tires featuring Cyber™ Tyre technology. This development highlights the strategic importance of the U.S. for Pirelli’s global growth roadmap, strengthening the company’s integrated industrial and technological presence in the country.

The announcement comes as Pirelli participates in the SelectUSA Investment Summit, the flagship event promoted by the U.S. Department of Commerce, where Cyber™ Tyre is being showcased as a core innovation shaping the future of smart mobility. 

Cyber™ Tyre is the world’s first hardware-and-software system capable of collecting data and information from sensors embedded in tires, processing them through Pirelli’s proprietary software and algorithms, and, by communicating in real time with the vehicle’s electronics, enabling new functionalities integrated with driving and control systems to enhance the driving experience and increase safety levels, as well as supporting connected infrastructure.

In a highly advanced market such as the United States, where digital and smart mobility solutions are rapidly expanding, Cyber™ Tyre represents a distinctive competitive advantage for Pirelli.

At SelectUSA, Cyber™ Tyre was showcased at the Georgia State booth, a particularly meaningful presence given Pirelli’s industrial footprint in the state, where it has been established for more than 20 years.

“The start of Cyber™ Tyre production in our Rome, Georgia plant is a significant milestone for Pirelli in this country,” said Claudio Zanardo, CEO of Pirelli North America. “It reflects our commitment to bringing advanced technologies like Cyber™ Tyre closer to the market, further strengthening our industrial footprint and innovation capabilities in the United States.”

To further enhance the role of Rome as a high-tech production site, Pirelli is finalizing the introduction of the latest version of the MIRS (Modular Integrated Robotized System) production process. It will be the most advanced manufacturing process for high-end, premium production within the entire Pirelli Group, and is exclusive to the Georgia factory. The process further enhances robotized production capabilities, increasing productivity, flexibility, and quality.

It is a highly digitalized system that enables a direct link between product design and its industrial application.

This development lays the groundwork for growth in Pirelli’s production capacity in Rome, an integral part of the Group’s industrial development plans, and will further strengthen Pirelli’s presence in the United States—one of its most important and strategic markets.

The Rome, Georgia, plant specializes in high-value tire production for the North American market. It also hosts a dedicated R&D center, further strengthening its role in technological development and product innovation.

The facility is recognized for its responsible sourcing practices, including the use of FSC® (Forest Stewardship Council®)-certified natural rubber, underscoring the company’s broader environmental commitment across its supply chain.

www.pirelli.com

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SOURCE Pirelli North America

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