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Printed Circuit Board (PCB) Market to Grow by USD 26.8 Billion (2025-2029), Driven by Smartphone Adoption, Report Highlights AI’s Redefining Role – Technavio

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NEW YORK, Jan. 27, 2025 /PRNewswire/ — Report with market evolution powered by AI – The global printed circuit board (PCB) market size is estimated to grow by USD 26.8 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 6.2%  during the forecast period. Rising adoption of smartphones is driving market growth, with a trend towards increasing inclination toward flexibility and industry automation. However, environmental concerns regarding PCBs poses a challenge. Key market players include APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd..

Key insights into market evolution with AI-powered analysis. Explore trends, segmentation, and growth drivers- View Free Sample PDF

Printed Circuit Board (PCB) Market Scope

Report Coverage

Details

Base year

2024

Historic period

2019 – 2023

Forecast period

2025-2029

Growth momentum & CAGR

Accelerate at a CAGR of 6.2%

Market growth 2025-2029

USD 26.8 billion

Market structure

Fragmented

YoY growth 2022-2023 (%)

5.8

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 88%

Key countries

China, Taiwan, South Korea, Japan, and India

Key companies profiled

APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd.

Market Driver

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices, particularly those related to 5G, Internet of Things (IoT), Internet of Vehicles, and artificial intelligence. Consumer electronics, including smartphones, cameras, PCs, tablets, and smart devices, are major consumers of PCBs. Semiconductor plants and IC substrate manufacturers are key players in the market, supplying components such as integrated circuits, resistors, electrolytic capacitors, PLCs, transistors, and composite epoxy materials. Automobile applications, including battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices, are also driving demand for PCBs. PCBs are essential in various industries, including communications, industrial automation, medical devices, and government institutions. The market is shifting towards flexible circuits, rigid-flex, and high-temperature performance PCBs, made of materials like glass fabric, FR-4, epoxy resin, and fiberglass. Environmental concerns, including electronic waste, lead, mercury, cadmium, brominated flame retardants, and other hazardous substances, are prompting the development of more sustainable PCB production methods. 3D printing and high-reliability PCBs are emerging trends in the market. The market’s future looks bright, with major players like Quanta Computer and Apple supplier continuing to drive demand for rigid PCBs. 

The automation of industries is a growing trend as businesses seek to enhance productivity and control costs. To maintain competitiveness, companies are adopting computers and machines for efficient control systems. Power consumption is a significant concern with the increasing power density of electric equipment. PCBs are essential in optimizing power usage within compact applications. Furthermore, the expanding use of cobots, industrial robots, and drones in automation will add value to this trend. PCBs enable optimal power consumption, contributing to overall efficiency and cost savings. 

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 Market Challenges

•         The Printed Circuit Board (PCB) market faces significant challenges as the demand for electronic devices continues to grow in sectors like 5G, Internet of Things (IoT), Internet of Vehicles, and consumer electronics. The integration of artificial intelligence and semiconductor plants in manufacturing processes increases the need for PCBs in various applications. However, concerns over electronic waste, lead, mercury, cadmium, and brominated flame retardants pose environmental challenges. PCBs are essential components in industries like communications, computers, and consumer electronics, including smartphones, cameras, and tablets. The automotive sector also relies on PCBs for battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices. Manufacturers of PCBs must ensure their products meet the demands of various industries while addressing challenges such as high temperatures, mechanical stress, and thermal stability. PCBs are used in industrial automation, medical devices, and military applications, requiring high structural integrity and flame-retardant nature. Government institutions and industries like Quanta Computer, an Apple supplier, require rigid PCBs made of materials like glass fabric, FR-4, and epoxy resin. The glass transition temperature, dielectric strength, dimensional stability, and electrical insulating qualities are crucial factors in PCB production. The emergence of 3D printing and flexible circuits, such as Rigid Flex, presents opportunities for innovation and growth in the PCB market. However, ensuring PCB reliability and addressing electrical property degradation remains a challenge.

•         The Printed Circuit Board (PCB) market involves the production and disposal of boards made primarily of metal, plastic, ceramic, and copper. These components, particularly epoxy resins containing chlorine, can pose environmental concerns due to their non-biodegradable nature. The industry has shifted from lead solders to lead-free alternatives to minimize toxicity. Proper dismantling of components is necessary before disposing of PCBs. Recycling presents challenges such as temperature rises, mechanical shocks, and delamination. A standard PCB comprises 40% metal, 30% plastic, and 30% ceramic, with the board itself consisting of 28% copper, 33% resins, and 40% other materials.

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Segment Overview 

This printed circuit board (pcb) market report extensively covers market segmentation by  

Type 1.1 Multi-layer1.2 HDI1.3 Single sided1.4 Double sidedEnd-user 2.1 Communication network infrastructure2.2 IT and peripherals2.3 Automotive2.4 Consumer electronics2.5 OthersGeography 3.1 APAC3.2 North America3.3 Europe3.4 Middle East and Africa3.5 South America

1.1 Multi-layer-  Multi-layer Printed Circuit Boards (PCBs) hold a dominant position in the global market in 2024 due to their versatility and complexity. These boards consist of multiple layers of substrate material, interconnected by conductive channels. The rising demand for compact and high-performance electronic devices in sectors like telecommunications, automotive, and consumer electronics fuels the need for multi-layer PCBs. Notable applications include smartphones, which require space optimization and sophisticated electronics. Advanced networking equipment, such as routers and servers, also heavily utilize multi-layer PCBs to enhance functionality. Automotive Electronic Control Units (ECUs) benefit from their compact design, ensuring efficient performance in confined spaces. As technology advances, the demand for multi-layer PCBs is anticipated to escalate, solidifying their role as a key product in the PCB industry. Consequently, the multi-layer product segment is poised for growth, driving the expansion of the global PCB market throughout the forecast period.

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Research Analysis

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices in various industries. The advent of 5G technology and the Internet of Things (IoT) are driving the market, with PCBs playing a crucial role in the development of telecommunication infrastructure. The IoT and Internet of Vehicles are also fueling the demand for PCBs in consumer electronics, including smartphones, cameras, and tripods. PCBs are essential components in the production of integrated circuits, resistors, electrolytic capacitors, PLCs, transistors, and composite epoxy, among others. Flexible circuits and rigid-flex PCBs are gaining popularity due to their ability to provide greater design flexibility and improved reliability. Fiberglass and other materials are used in the manufacturing of PCBs to ensure their durability and strength. Overall, the PCB market is poised for continued growth as the demand for electronic devices and advanced technologies continues to soar.

Market Research Overview

The Printed Circuit Board (PCB) market is witnessing substantial growth driven by the rising demand for electronic devices across multiple industries. With the rollout of 5G technology and the expansion of the Internet of Things (IoT), IoT gadgets, smartphones, cameras, PCs, tablets, and consumer electronics are becoming more advanced and sophisticated, driving up the need for high-quality PCBs. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, brominated flame retardants, and semiconductor plants, which raise environmental concerns. PCBs are essential components in various industries, including automotive applications, where they are used in battery control systems, engine timing systems, digital displays, audio systems, power relays, antilock brake systems, and smart devices. In industrial automation, PCBs are used in computer communications, PLCs, transistors, and other electronic equipment, ensuring structural integrity and mechanical strength, even under high temperatures and mechanical stress. PCBs are also used in medical devices, industrial robots, and automation machinery, making them indispensable in various sectors. The market for PCBs is expected to grow further as millennials’ demand for advanced technology continues to rise. The PCB foundation material, including composite epoxy, fiberglass, and FR-4 materials, is crucial in ensuring electrical insulating qualities, dimensional stability, and thermal insulation properties. The use of 3D printing technology in PCB production is also gaining popularity, offering benefits like reduced production time and cost. However, the reliability of PCBs is crucial, and electrical property degradation can lead to significant issues. Government institutions play a vital role in regulating the production and disposal of electronic waste, ensuring the safe disposal of materials like lead, mercury, cadmium, and brominated flame retardants.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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SSC SECURITY SERVICES CORP. ANNOUNCES SHAREHOLDER APPROVAL OF PREVIOUSLY ANNOUNCED PLAN OF ARRANGEMENT

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8 minutes ago

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July 22, 2026

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REGINA, SK, July 22, 2026 /CNW/ — SSC Security Services Corp. (TSXV: SECU) (US: SECUF) (“SSC” or the “Company”) today announced the voting results from its special meeting of holders (the “Shareholders”) of common shares (the “Shares”) of the Company held today (the “Meeting”) in connection with the previously announced plan of arrangement under the Business Corporations Act, 2021 (Saskatchewan) (the “Arrangement”), pursuant to which Universal Protection Service, LP (the “Parent”), through its wholly-owned subsidiary, 102236724 Saskatchewan Ltd. (the “Purchaser”, and together with the Parent, “Allied Universal”), will acquire all of the issued and outstanding Shares for $4.4075 per Share in cash, and pursuant to which certain officers and directors of the Company (the “Management Purchasers”) will purchase the Company’s legacy assets and cyber security business in a management buy-out transaction (the “MBO” and collectively with the Arrangement, the “Transaction”).

The Arrangement requires (i) the approval of 66 2/3% of the votes cast by Shareholders (including the Management Purchasers) present or represented by proxy and entitled to vote at the Meeting and (ii) the approval of a simple majority (more than 50%) of the votes cast by Shareholders present or represented by proxy and entitled to vote at the Meeting, other than the Management Purchasers and any other person required to be excluded from such vote for the purpose of Multilateral Instrument 61-101 – Protection of Minority Security Holders in Special Transactions (the “Minority Shareholders”). At the Meeting, the resolution approving the Arrangement was approved by (i) 99.99% of the votes cast by Shareholders, and (ii) 99.97% of the votes cast by the Minority Shareholders.

Remaining Conditions to Completion of the Arrangement

Completion of the Transaction remains subject to the satisfaction or waiver of certain closing conditions that are set out in the arrangement agreement entered into between the Company and Allied Universal on May 26, 2026 (the “Arrangement Agreement”), including receipt of final court approval and approval of the TSX Venture Exchange. SSC intends to seek a final order (the “Final Order”) of the Court of King’s Bench for Saskatchewan to approve the Arrangement at a hearing to be held on July 27, 2026.

Subject to obtaining the Final Order and the satisfaction or waiver of the remaining conditions in the Arrangement Agreement, the Transaction is anticipated to close on July 31, 2026.

About SSC

SSC Security Services Corp. is Canada’s largest publicly traded security company. SSC acts as a public holding company investing in physical, electronic and cyber security businesses. The Company has one wholly-owned operating subsidiary: Logixx Security Inc., which provides physical, electronic and cyber security services to primarily commercial, industrial and public sector clients. The Company’s clients include federal and provincial governments, Crown corporations, and many high-profile corporate and public sector clients such as hospitals, airports, utility companies and police forces.

Forward Looking Statements

This release includes forward-looking statements concerning the future results, future performance, intentions, objectives, plans and expectations of the Company. Often, but not always, forward-looking statements can be identified by the use of words such as “plans”, “expects”, “is expected”, “estimates”, “intends”, “anticipates”, “believes” or variations of such words and phrases (including negative and grammatical variations) or state that certain actions, events or results “may”, “could”, “would”, “might” or “will” be taken, occur or be achieved. The forward-looking events and circumstances discussed in this release may not occur and could differ materially as a result of known and unknown risks, uncertainties affecting SSC, including risks regarding economic factors and the equity markets generally and many other factors beyond the control of SSC. Without limiting the generality of the foregoing, this release contains forward-looking statements pertaining to: the anticipated timing of the Transaction; receipt of required court and stock exchange approvals; satisfaction of closing conditions; and the anticipated effective date of the Arrangement. Risks and uncertainties that could cause actual results to differ materially include: failure to obtain court or stock exchange approvals; failure to satisfy closing conditions; failure of the parties to complete the Transaction for any reason, including termination of the Arrangement Agreement; legal challenges to the Arrangement; and risks and uncertainties discussed in SSC’s disclosure documents filed on SEDAR+ at www.sedarplus.ca. Forward-looking statements are not guarantees of future performance. These forward-looking statements should not be relied upon as representing the views of SSC as of any date after the date of this Release. Although SSC has attempted to identify important factors that could cause actual actions, events or results to differ materially from those described in forward-looking statements, there can be no assurance that forward-looking statements will prove to be accurate, as actual results and future events could differ materially from those anticipated in such statements. Accordingly, readers should not place undue reliance on forward-looking statements. The forward-looking statements contained in this Release are expressly qualified in their entirety by this cautionary statement. The forward-looking statements included in this Release are made as of the date of this Release and SSC does not undertake to publicly update such forward-looking statements to reflect new information, subsequent events or otherwise, except as required by applicable securities laws.

Neither TSX Venture Exchange nor its Regulation Services Provider accepts responsibility for the adequacy or accuracy of this release.

SOURCE SSC Security Services Corp.

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GMI Cloud Announces Strategic Compute Collaboration With NVIDIA

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8 minutes ago

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July 22, 2026

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The collaboration advances GMI Cloud’s selective partnership strategy and supports its next phase of AI infrastructure growth

MOUNTAIN VIEW, Calif., July 22, 2026 /PRNewswire/ — GMI Cloud, a leading AI-native cloud provider delivering high-performance GPU infrastructure and inference services, today announced a strategic collaboration with NVIDIA as part of its selective approach to building long-term compute partnerships.

In support of this strategy, GMI Cloud has committed $500 million in CapEx to expand its compute capabilities and serve growing customer demand. The commitment represents a significant investment in the company’s next phase of infrastructure development.

GMI Cloud has also secured nine-figure contracts with a leading U.S. frontier AI enterprise, providing a strong commercial foundation for its continued growth.

GMI Cloud is pursuing a selective partnership model centered on a limited number of strategic relationships. The collaboration builds on GMI Cloud’s continued partnership with NVIDIA and brings together long-term compute planning with contracted customer demand.

GMI Cloud is among the earliest cloud providers to adopt this new compute partnership model, marking an important step in the company’s expansion and partnership strategy.

The $500 million CapEx commitment, nine-figure customer contracts, and selective partnership strategy establish the foundation for GMI Cloud’s next stage of growth. The company is set to continue this trajectory as it expands its compute capabilities and supports the evolving needs of frontier AI customers. For more information, visit www.gmicloud.ai.

About GMI Cloud
GMI Cloud is an AI-native cloud infrastructure company powering the next generation of AI applications. The company provides high-performance GPU infrastructure, Model-as-a-Service, dedicated endpoints, and AI workload deployment solutions for developers and enterprises building production AI systems. GMI Cloud helps teams move from experimentation to production with scalable compute, flexible infrastructure, and an ecosystem built for modern AI builders. For more information visit gmicloud.ai.

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SOURCE GMI Cloud

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ROKFORM Launches Rugged Case for Samsung Galaxy Z Fold8 and Z Fold8 Ultra

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8 minutes ago

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July 22, 2026

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Complete foldable protection with six-foot drop rating, MAGMAX ™ magnetic grip, and RokLock ® twist-lock mounting

IRVINE, Calif., July 22, 2026 /PRNewswire/ — ROKFORM today launched its Rugged Case for the Samsung Galaxy Z Fold8 and Galaxy Z Fold8 Ultra. Built with a slim, two-piece shell design — not just a backplate — the Rugged Case delivers six-foot drop protection, full hinge coverage, and secure RokLock® mounting across both foldable models.

“Users get the full ROKFORM experience with the Rugged Case, including incredible drop protection, RokLock® mounting, and MAGMAX™ magnetic strength, all in a design built specifically around the unique needs of a foldable device,” said Jeff Whitten, ROKFORM CEO.

The two-piece shell locks together to protect the outer screen, back, and spine of the Galaxy Z Fold8. In addition, the case is engineered to guard one of the most critical and vulnerable components on foldable phones — the hinge — from drops and impacts with full hinge coverage. The case exceeds military-grade drop protection standards from six feet, with a dual-layer build and reinforced corners designed to absorb real-world impact.

ROKFORM’s patented RokLock® twist-lock system delivers rock-solid, wobble-free connection to ROKFORM’s full ecosystem of car, bike, and motorcycle mounts. Combined with MAGMAX™ magnets, which deliver 3x more holding strength over standard MagSafe® magnets, users get an ultra-secure magnetic grip for mounting and use with other accessories.

The case is compatible with ROKFORM wireless chargers and compatible wireless charging accessories.

The Rugged Case for the Samsung Galaxy Z Fold8 and Z Fold8 Ultra retails for $79.99 and will be available August 5, 2026 at rokform.com.

About ROKFORM:
Founded in 2010, ROKFORM’s small but dedicated team has bootstrapped its way to becoming a leader in the design and manufacturing of innovative consumer electronics products. It is based in Irvine, California. With nearly 20 patents, ROKFORM remains a leader in the premium active lifestyle consumer electronics niche, with innovative designs to protect and enhance the world’s mobile devices. Products are designed and shipped directly from California headquarters, and customers can visit ROKFORM’s showroom to experience them. Learn more at rokform.com.

Contact:
Haley Lush
775-204-7975
419258@email4pr.com

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