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Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031 – Find Out Why | Valuates Reports

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BANGALORE, India, April 24, 2025 /PRNewswire/ — Advanced Semiconductor Packaging Market is Segmented by Type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), 2.5D/3D), by Application (Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics).

The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.

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Major Factors Driving the Growth of Advanced Semiconductor Packaging Market:

The advanced semiconductor packaging market is poised for robust, double digit growth through 2030 as value creation shifts decisively from front end scaling to back end integration. Demand for heterogeneous chiplet architectures, high bandwidth memory stacks, ultra thin fan out modules, and automotive grade power packages is expanding. Continuous 5 G densification, cloud AI acceleration, and electric vehicle adoption keep volumes rising and average selling prices escalating, even as substrate and equipment supply tightens.

With sustainability goals favouring yield efficient known good die assembly and governments underwriting regional resiliency, the market is set to outpace the broader semiconductor industry, cementing advanced packaging as the chief engine of performance and profitability in the silicon value chain.

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TRENDS INFLUENCING THE GROWTH OF THE ADVANCED SEMICONDUCTOR PACKAGING MARKET:

Flip chip packaging energises the advanced semiconductor packaging landscape by eliminating long wire bonds and replacing them with dense arrays of solder bumps that connect the die face down to the substrate. The ultra short electrical path lowers inductance, cuts signal latency, and boosts bandwidth—precisely the performance mix demanded by AI accelerators, high end mobile SoCs, and data centre GPUs. FC’s excellent thermal profile distributes heat efficiently across copper pillars, enabling higher power envelopes without throttling. Yield learning on 3 nm and 2 nm nodes has driven down bump pitch variability, making FC the default choice for heterogeneously integrated chiplets as well as monolithic dies. As fabless giants push multi die systems, FC capacity expansion directly converts into market wide revenue uplift.

Fan out WLP sidesteps the substrate entirely, redistributing I/O in epoxy mould compound and delivering ultra thin packages ideal for space constrained devices. By decoupling die size from I/O count, FO WLP unlocks high pin count connectivity for wearables, true wireless earbuds, RF front ends, and millimetre wave 5 G modules. The ability to singulate multiple known good dies on a reconstituted wafer trims test time and boosts overall yield. Simpler stack ups translate to fewer materials and lower assembly cost relative to FC substrates, extending advanced packaging economics to mid range handsets and IoT sensors. As panel level fan out lines ramp in Korea, Taiwan, and China, the technology’s keen cost per area advantage is widening its addressable market and fuelling sustained revenue growth.

Automotive electrification and autonomy require rugged, high reliability packaging that survives extreme temperature cycles, vibration, and humidity over 15 plus year lifetimes. ADAS domain controllers, radar, LiDAR, battery management ICs, and power inverters now employ advanced packaging—embedded die, FC CSP, and molded array packages—to meet stringent AEC Q100 Grade 0 standards. Meanwhile, zonal E/E architectures multiply the number of high speed SerDes links in a vehicle, driving demand for advanced substrates with sub 10 µm line width/spacing. Automakers’ push for over the air update capability places server class processors under the hood, intensifying the need for high density interposers and chiplet based designs. As electric vehicle volumes climb, long term supply agreements between tier one OSATs and OEMs lock in robust, multi year growth for advanced semiconductor packaging.

The shift from monolithic scaling to heterogeneous integration is propelling demand for advanced packaging as the primary vehicle for combining logic, memory, analog, and photonics dies in a single system in package. High density interposers, hybrid bonding, and through silicon vias allow designers to mix process nodes cost effectively, squeezing more functionality into smaller footprints while sidestepping reticle limits and yield cliff risks. The move brings architectural freedom that conventional wire bond could never match, positioning advanced packaging as a critical enabler of continued silicon centric innovation despite slowing Moore’s law node progression.

Ubiquitous 5 G base stations, open RAN radios, and edge AI gateways rely on RF front end modules and high performance baseband processors that can only meet thermal and signal integrity targets through advanced fan out, FC BGA, or system in package approaches. Carrier aggregation, beam forming, and ultra low latency requirements all drive higher bandwidth density, tighter phase noise, and harsher heat loads—parameters that modern packaging resolves far better than legacy solutions. As telcos spread mmWave and sub 6 GHz coverage, orders for multi chip, antenna in package modules scale in lock step with network densification.

Large language model training, graph analytics, and computational lithography require massive chip to chip bandwidth inside servers. Silicon interposers with micro bump pitches under 40 µm deliver terabytes per second of parallel throughput between logic tiles and HBM stacks, slashing energy per bit and shrinking board level congestion. Hyperscalers’ appetite for AI accelerators forces OSATs to develop bigger organic substrates, advanced underfills, and multi bridge configurations, translating directly into higher ASPs and multi year capacity investments.

Power electronics for traction inverters and fast chargers call for wide bandgap GaN and SiC dies co packaged with control ICs on high thermal conductivity substrates such as AlN or SiN. Advanced packaging enables epoxy mould compound alterations to withstand 500 A per phase, while integrated heat spreaders lower junction temperatures. Sensor fusion ECUs and domain controllers likewise consolidate into high pin count packages, further expanding automotive share of the total addressable market.

Demand for sleeker smartphones, AR glasses, and health monitoring wearables compresses z height budgets, pushing OEMs toward fan in WLP, FO PLP, and moulded core embedded packages. The reduction in discrete components per board frees up battery space, enhances water resistance, and shortens design cycles. As brands fight for feature differentiation within pocket size constraints, advanced packaging’s ability to co integrate MEMS, PMICs, and RF circuits sustains its growth momentum.

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ADVANCED SEMICONDUCTOR PACKAGING MARKET SHARE:

Asia Pacific dominates volume with Taiwan and South Korea housing the world’s largest OSATs and foundry adjacent packaging lines, but mainland China’s accelerated investment is narrowing the gap. North America leads in advanced interposer R&D thanks to hyperscaler co development, while Europe’s automotive strength sustains steady demand for rugged packages. Emerging hubs in India and Southeast Asia benefit from supply chain diversification, collectively creating a vibrant, geographically stratified demand profile.

Key Companies:

IMF GmbHAmkorSPILIntel Corp.JCETASETFMETSMCHuatianPowertech Technology IncUTACNepesWalton Advanced EngineeringKyoceraChipbondChipMOS

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Semiconductor Advanced Packaging Market was estimated to be worth USD 15670 Million in 2023 and is forecast to a readjusted size of USD 26270 Million by 2030 with a CAGR of 7.5% during the forecast period 2024-2030.Semiconductor Advanced Packaging Materials Market was valued at USD 13610 Million in the year 2024 and is projected to reach a revised size of USD 28050 Million by 2031, growing at a CAGR of 10.2% during the forecast period.Advanced Packaging Inspection and Metrology Equipment Market was valued at USD 817 Million in the year 2024 and is projected to reach a revised size of USD 1530 Million by 2031, growing at a CAGR of 9.5% during the forecast period.Semiconductor Packaging and Test Systems Market was valued at USD 14540 Million in the year 2024 and is projected to reach a revised size of USD 21780 Million by 2031, growing at a CAGR of 6.0% during the forecast period.Advanced Packaging Inspection Systems market is projected to grow from USD 419.7 Million in 2024 to USD 723.5 Million by 2030, at a Compound Annual Growth Rate (CAGR) of 9.5% during the forecast period.Mold Release Film for Semiconductor Packaging MarketAdvanced Packaging Lithography Equipment MarketAdvanced Packaging Interconnect Electroplating Solution MarketTin Plating Solution for Semiconductor Packaging Market3D-IC Packaging Market was valued at USD 18470 Million in the year 2024 and is projected to reach a revised size of USD 29850 Million by 2031, growing at a CAGR of 7.2% during the forecast period.Advanced Packaging for Automotive Chips market was valued at USD 463 Million in 2023 and is anticipated to reach USD 969.1 Million by 2030, witnessing a CAGR of 11.7% during the forecast period 2024-2030.

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Technology

Hexagon releases new targets at its Capital Markets Day 2026

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Hexagon is the global leader in precision measurement, positioning and autonomous solutions with a serviceable addressable market of ~€38bn by 2030.Hexagon’s €3.7bn in revenue and ~17,000 employees are across three Business Areas – Manufacturing Intelligence, Infrastructure & Especial and Autonomous Solutions plus a Robotics Division currently in an investment phase.Recent portfolio actions, including the upcoming separation of Octave, the sale of the Design & Engineering business and the announced acquisition of Agate Technologies, have focused Hexagon on its strong core business in precision measurement & positioning technologies.Hexagon’s organic growth will be driven by strong end market potential and structural tailwinds, new product introductions and an operating model focused on accountability and closeness to customers.Hexagon launches new financial targets for the 2026 – 2030 period of average organic revenue growth of 4-6%, an EBITDA margin of 24-26%[1] and an EBITDA cash conversion of 90-100%. It also targets reducing Scope 1 & 2 emissions by 70% by 2030, from a 2022 baseline.

[1] EBITAC is defined as adjusted EBIT1 excluding capitalised and amortised R&D. See pages the appendix for further information

STOCKHOLM, April 30, 2026 /PRNewswire/ — Hexagon AB is hosting its Capital Markets Day today in London. At the event, President and CEO Anders Svensson, CFO Enrique Patrickson and the Presidents of Hexagon’s Business Areas will set out Hexagon’s ambitious growth strategy and its new 2026–2030 financial targets.

“Hexagon enters this new phase as a focused global leader in precision measurement and positioning, with a solutions portfolio essential to enabling industrial autonomy,” said Anders Svensson, President and CEO of Hexagon. “Our new targets reflect both the quality of our portfolio and the discipline of The Hexagon Way. With a strong leadership team and the financial flexibility to invest behind our growth priorities both organically and through synergistic acquisitions, we are well placed to deliver value creation for shareholders.”

“Today we are taking transparency to the next level — enhancing our disclosures, introducing EBITAC as our key profitability metric and providing clarity around our capital allocation priorities,” said Enrique Patrickson, CFO of Hexagon. “EBITAC is the right metric for Hexagon, a technology company with a significant R&D spend, funding market-leading product launches that drive our growth. With additional transparency comes additional accountability. We commit to drive capital allocation around R&D, M&A and Dividends with discipline and rigor.”

New sustainability targets

70% reduction in Scope 1 & 2 emissions by 2030 (from 2022 baseline)Net-zero by 2050

New 2026–2030 financial targets

Average annual organic revenue growth of 4-6%EBITAC margin in the range of 24-26%Annual cash conversion (of EBITAC) of 90-100%

A focused group focused on enabling industrial autonomy

Hexagon has undertaken significant portfolio changes, namely the upcoming spin-off of Octave and the sale of the Design & Engineering business. The resulting business is a focused global leader in precision measurement and positioning with proforma 2025 revenue of €3.7bn, EBITAC of €826m (22% EBITAC margin) and ~17,000 employees.

Hexagon is organised into three business areas – Manufacturing Intelligence, Infrastructure & Geospatial (formerly Geosystems) and Autonomous Solutions – alongside the Robotics Division, currently in an investment phase.

The overarching growth opportunity that underpins Hexagon’s long-term strategy is enabling customers to move towards true autonomy in their industrial operations.

President and CEO Anders Svensson will outline how Hexagon’s precision measurement and positioning technologies, digital twins and spatial intelligence capabilities are essential to enabling this true industrial autonomy. Hexagon holds market leadership positions across its serviceable addressable market, which is estimated to grow to ~€38bn by 2030.

Anders will also outline the key changes to Hexagon’s operating model. The Hexagon Way is an accountability-driven, decentralised model built around three strategic enablers: innovation and AI; portfolio management and M&A; and people & culture.

Central to this model is a clear accountability structure: the group’s three Business Areas are divided into 17 Divisions, each with full ownership of its financial performance and a defined strategic mandate covering three value creation priorities – Stability, Profitability and Growth.

The group-wide enablers allow Divisions to identify and execute on strategies targeted specifically to their markets and customers while drawing on the scale and resources of the broader Hexagon organisation. This balance of focused execution at the Division level and shared capability at the group level is designed to unlock each Division’s full potential and drive overall performance and shareholder value.

Hexagon’s new mid-term financial targets for 2026 to 2030 will be outlined by CFO Enrique Patrickson alongside a new financial framework including revised metric definitions designed to improve transparency, capital allocation and shareholder value creation.

The new 2026-30 through the cycle targets are:

Average annual organic revenue growth of 4–6% (CAGR 2026–2030)EBITAC margin in the range of 24–26%Annual cash conversion (of EBITAC) of 90–100%

In 2025, Hexagon achieved organic growth of 2.6%, an EBITAC margin of 22% and cash conversion (of EBITAC) of 109%.

Capital allocation

Hexagon’s capital allocation priorities are, in order: reinvestment in organic growth, value-accretive bolt-on M&A, a progressive dividend, and selective larger strategic moves where they enhance long-term shareholder value. The Group’s strong cash conversion and balance sheet provide the flexibility to pursue these priorities through the cycle.

Business Area presentations

Senior leadership from Hexagon’s Business Areas will provide additional context on strategy, markets and Business Area targets. The presenters will be:

Andreas Renulf, President, Manufacturing Intelligence Business AreaHenning Sandfort, President, Infrastructure & Geospatial Business AreaGordon Dale, President, Autonomous Solutions Business AreaArnaud Robert, President, Robotics Division

EBITAC – EBIT1 excluding capitalisation & amortisation of R&D

Hexagon is introducing EBITAC as its primary profitability measure. By immediately reflecting the full cost of R&D investments on the P&L, it will provide a tool to focus management firmly on the return on investment of R&D, go-to-market and capital investments and support performance management and capital allocation. The top end of the target EBITAC margin range (26%) was last achieved in 2021 and corresponds to the highest EBIT1 margin achieved by Hexagon in the last 5-years.

It is defined as adjusted EBIT1 excluding capitalised and amortised R&D.

Hexagon will continue to report EBIT1 (adjusted operating profit) for full transparency. A bridge between reported EBIT, EBIT1 and EBITAC and the EBITAC performance between 2024 and 2025 can be found in the appendix to this announcement.

Profitability metric bridge, 2025

Item

€M

Reported EBIT

575

Add: in year adjustments (impairments, restructuring, LTIP, PPA)

+372

EBIT1

947

Subtract: R&D capitalisation

-340

Add: R&D amortisation

+195

EBITAC

802

Subtract: in year robotics costs

+24

EBITAC (target definition)

826

Robotics – AEON, a potential global market leader in humanoid Robotics

Investment in Robotics to double from €24m in 2025 to €50m in 2026.Pilots with BMW, Schaeffler, Pilatus & Fill underway.Robotics is an exciting opportunity for significant value creation.

Due to its rapidly evolving structure Hexagon has decided to exclude Robotics from the 2026-30 financial targets and the calculation of EBITAC. This gives better visibility on the core group performance.

The financial performance of Robotics will be disclosed on a quarterly basis.

New sustainability targets

Hexagon is committed to operating responsibly for the good of the environment. It has set challenging new targets for emission reductions. Hexagon targets a 70% reduction in Scope 1 & 2 emissions by 2030 (from a 2022 baseline) and net-zero in Scope 1, 2 & 3 by 2050.

In 2025 Hexagon saw a 33% reduction in Scope 1 & 2 emissions from its 2022 baseline.

Joining instructions

The webcast will be streamed here: https://edge.media-server.com/mmc/p/d2han2qw/

FOR MORE INFORMATION, CONTACT:  
Tom Hull, Head of Investor Relations, Hexagon AB, +44 7442 678 437, ir@hexagon.com
Anton Heikenström, Investor Relations Manager, Hexagon AB, +46 8 601 26 26, ir@hexagon.com

This is information that Hexagon AB is obliged to make public pursuant to the EU Market Abuse Regulation. The information was submitted for publication, through the agency of the contact person set out above, at 08:00 CET on 30 April 2026.

Appendix – Reconciling EBIT1 & EBITAC performance, 2025 quarterly

Metric

Q1 2025

Q2 2025

Q3 2025

Q4 2025

FY 2025

Revenue €m

961.5

1,010.5

976.0

1,053.1

4,001.2

EBIT1 €m

248.7

260.0

264.7

299.1

1,072.4

Subtract: capitalisation of R&D €m

-94.6

-94.7

-91.1

-84.1

-364.5

Add: amortisation of R&D €m

54.6

54.3

59.2

50.4

218.5

EBITAC €m

208.7

219.6

232.8

265.3

926.4

In year robotics cost €mEBIT

-4.7

-5.9

-5.6

-7.6

-23.7

EBITAC (excluding robotics costs)

213.4

225.5

238.3

272.9

950.1

EBIT1 margin %

25.9 %

25.7 %

27.1 %

28.4 %

26.8 %

EBITAC margin %

21.7 %

21.7 %

23.8 %

25.2 %

23.2 %

EBITAC margin % (excluding robotics costs)

22.2 %

22.3 %

24.4 %

25.9 %

23.7 %

Appendix – Reconciling EBIT1 & EBITAC performance, 2025 quarterly, excluding Design & Engineering

Metric

Q1 2025

Q2 2025

Q3 2025

Q4 2025

FY 2025

Revenue €m

888.2

939.4

907.1

980.3

3,715.0

EBIT1 €m

225.0

231.1

235.5

255.4

947.0

Subtract: capitalisation of R&D €m

-88.6

-88.0

-84.8

-78.3

-339.6

Add: amortisation of R&D €m

48.2

48.0

53.3

45.8

195.3

EBITAC €m

184.6

191.1

204.0

223.0

802.7

In year robotics cost €m

-4.7

-5.9

-5.6

-7.6

-23.7

EBITAC (excluding robotics costs)

189.3

196.9

209.6

230.5

826.4

EBIT1 margin %

25.3 %

24.6 %

26.0 %

26.1 %

25.5 %

EBITAC margin %

20.8 %

20.3 %

22.5 %

22.7 %

21.6 %

EBITAC margin % (excluding robotics costs)

21.3 %

21.0 %

23.1 %

23.5 %

22.2 %

This information was brought to you by Cision http://news.cision.com

https://news.cision.com/hexagon/r/hexagon-releases-new-targets-at-its-capital-markets-day-2026,c4342580

The following files are available for download:

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Hexagon releases new targets at its Capital Markets Day 2026

 

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SOURCE Hexagon

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Accountants Streamline Cash Flow with ezACH Direct Deposit Software

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Eliminate payment delays, reduce manual errors, and gain full control with a low-cost and high-quality ACH solution built for modern accounting workflows.

REDMOND, Wash., April 30, 2026 /PRNewswire/ — Halfpricesoft.com developers understand that businesses demand faster payments and greater financial control, and now accountants are rethinking how they manage transactions. ezACH direct deposit software will simplify payment processing, accelerate cash flow, and reduce costly errors.

Clients are encouraged to download and test ezACH today to purchase to confirm compatibility.

ezACH empowers accountants to securely process electronic payments for clients, vendors, payroll, and tax obligations, all from one streamlined platform. By generating ACH files that can be uploaded directly to a bank, the software removes the need for manual payment handling and outdated processes.

“Speed and accuracy are critical in today’s financial environment,” said Dr. Ge, Founder of Halfpricesoft.com. “ezACH gives accountants the ability to process multiple payments quickly and securely, without added complexity or cost.”

Designed with flexibility in mind, ezACH allows users to manage unlimited transactions for unlimited companies at a one-time flat rate of $199.00, making it a cost-effective alternative to subscription-based payment platforms. Try it today!

Why Accountants Are Making the Switch:

Process ACH payments for vendors, clients, payroll, and tax agenciesEliminate manual entry and reduce costly errorsImport data easily from CSV files or other Halfpricesoft applicationsHandle unlimited companies and transactions with no recurring feesMaintain full control over payment timing and processingClients can upload transactions for up to $4.99 to test compatibility

Halfpricesoft.com offers a variety of applications that will seamlessly integrate with ezACH software:

ezPaycheck: A new version of ezACH has just been released to support import CSV with ezPaycheck importing. ezCheckprinting: Business check writer for vendors, miscellaneous and draft checks. https://www.halfpricesoft.com/product_ezCheck.aspezAccounting: DIY in-house bookkeeping and payroll solution for one flat rate. https://www.halfpricesoft.com/accounting/accounting-software.asp

With a one-time cost of $199 per installation, ezACH offers long-term savings compared to subscription-based services. There are no hidden fees, and users can process unlimited ACH transactions. (Note: Banks may apply their own ACH processing fees. We recommend contacting your bank for compatibility prior to purchase).

Simplify the business operations and boost efficiency with the powerful, all-in-one solutions fromHalfpricesoft.com. To save both time and money, get started today at HalfPriceSoft.com for no cost or obligation

About Halfpricesoft.com

Halfpricesoft.com has been delivering affordable, reliable business software solutions for over 20 years. Its suite of products, including payroll, accounting, check printing, tax filing, and ACH deposit software, helps small businesses, accountants, and nonprofits streamline operations and reduce costs. Trusted by thousands nationwide, Halfpricesoft.com remains committed to simplifying financial management with powerful, budget-friendly tools.

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SOURCE Halfpricesoft.com

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Neusoft Smart Go and Tencent Cloud Forge Strategic Partnership to Build a New AI-Powered Intelligent Cockpit Ecosystem

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BEIJING, April 30, 2026 /PRNewswire/ — At Auto China 2026, Neusoft Smart Go, a subsidiary of Neusoft Corporation (SSE:600718), officially announced its strategic upgrade. The company now aims to become a global leading provider in full-domain upper-body electronics solutions for intelligent vehicles. At the same time, Neusoft Smart Go and Tencent Cloud announced a strategic partnership. Aligning with “AI-defined vehicles” trend, the two parties will focus on key areas such as intelligent cockpits, on-device AI large model applications, ecosystem content integration, in-vehicle cybersecurity, and cloud services. By integrating their technologies and resources, they will engage in in-depth collaboration to develop AI-powered intelligent cockpit products and solutions that offer enhanced interactivity and emotional experiences, accelerating the intelligent transformation of entire vehicles.

The integration of AI large models and ecosystems into vehicles is essentially a full-chain systematic project covering hardware-software architecture adaptation, data processing, compliance assurance, and real-time response. Currently, automakers face challenges such as high in-house R&D expenses, ecosystem integration hurdles, and a lack of differentiated user experiences. They urgently require full-domain solutions that seamlessly integrate hardware and software, offer comprehensive ecosystem coverage, and enable rapid mass production to meet users’ core demands for multi-modal interaction, full-scenario services, and continuous OTA updates.

As a leading cloud service provider in China, Tencent Cloud has core strengths in on-device large models, in-vehicle ecosystems and applications, cloud services, and data compliance assurance. It also offers a full-chain app ecosystem spanning social media, music, maps, and more. In this partnership, the two parties will take Neusoft Smart Go’s next-gen intelligent cockpit system as the core platform, deeply integrating Tencent Cloud’s on-device large models to jointly develop a benchmark AI-powered intelligent cockpit featuring natural conversations, proactive interactions, and highly emotional, smooth experiences. Furthermore, they will fully integrate a wide range of ecosystem apps, enabling seamless transitions between mobile phones and in-vehicle systems across all scenarios.

At present, Neusoft Smart Go has established a product matrix covering a full range of in-vehicle electronics solutions, including central computing platforms, cockpit-driving-parking integration, intelligent cockpits, intelligent communications, intelligent audio systems, and zonal control units. Through a dual-track strategy of high-end cutting-edge solutions and mature standardized products, it can flexibly meet the mass production needs of vehicle models across different regions and price segments worldwide. Leveraging Tencent’s intelligent driving cloud, data compliance, OTA technical support, and AI platform services, the two parties will provide stable, secure, and intelligent hardware-software integrated solutions tailored to the diverse needs of global automakers, comprehensively assisting them in achieving intelligent and AI-driven upgrades for entire vehicles.

Jian Guodong, Senior Vice President of Neusoft and CEO of Neusoft Smart Go, said, “The integration of AI large models and full-scenario ecosystems represents an inevitable trend and a shared vision for both Neusoft Smart Go and Tencent Intelligent Mobility. Leveraging Neusoft Smart Go’s technical expertise in the full domain of upper-body electronics and Tencent’s leading solutions in AI large models and full-chain ecosystems, the two parties will collaborate to provide global automakers with truly mass-producible and evolvable AI-powered intelligent cockpit solutions.”

Zhong Xuedan, Vice President and Head of Tencent Intelligent Mobility, said, “We share complementary strengths and similar philosophies with Neusoft Smart Go, laying a solid foundation for cooperation. Both parties will further deepen cooperation in AI-powered intelligent cockpits, jointly exploring proactive interactions and emotional services powered by large models, transforming the cockpit into a smarter companion that better understands users.”

The deep integration of on-device AI large models and full-scenario ecosystems is reshaping the value boundaries and user experiences of intelligent cockpits. The automotive industry needs to accelerate innovation and mass production, achieving a balance between advanced technologies and cost-effectiveness. Neusoft Smart Go will focus on enhancing its systematic integration, software-hardware synergy, and global delivery capabilities. Through collaboration with more ecosystem partners, it will provide sustained momentum for the intelligent transformation of the automotive industry.

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SOURCE Neusoft Corporation

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