Technology

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors

Published

2 years ago

June 4, 2024

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology

TOKYO, June 3, 2024 /PRNewswire/ — Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.

This agreement is part of an international collaboration within the framework of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project being conducted by Japan’s New Energy and Industrial Technology Development Organization (NEDO) and builds on an existing agreement with IBM for the joint development of 2nm node technology. As part of the agreement, IBM and Rapidus engineers will work in collaboration at IBM’s facilities in North America for R&D and manufacturing of semiconductor packaging for high-performance computer systems.

Over the years, IBM has accumulated R&D and manufacturing technologies for semiconductor packaging for high-performance computer systems. The company also has a wealth of experience with joint development partnerships with Japanese semiconductor manufacturers, as well as manufacturers of semiconductors, package manufacturing equipment, and materials. Rapidus aims to leverage this expertise to quickly establish cutting-edge chiplet packaging technology.

Rapidus President and CEO Dr. Atsuyoshi Koike commented: “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce today this partnership with IBM to establish chiplet packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”

Darío Gil, SVP and Director of Research at IBM, said: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”

About IBM
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. More than 4,000 government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s legendary commitment to trust, transparency, responsibility, inclusivity and service. Visit ibm.com for more information.

About Rapidus
Rapidus Corporation aims to develop and manufacture the world’s most advanced logic semiconductors. By developing and providing services to shorten cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus creates new industries together with customers. We continue to embrace challenges that contribute to the fulfillment, prosperity, and happiness of people’s lives using semiconductors.

Media contacts:

Kreab K.K. (Japan)
Kunihiko Yasue, Kreab
E-mail: kyasue@kreab.com

Takano Okumoto, Kreab
E-mail: tokumoto@kreab.com

Miki Yagi, Kreab
E-mail: myagi@kreab.com

Breakaway Communications (U.S.)
Devan Gillick, rapidus@breakawaycom.com

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SOURCE Rapidus Corporation

Technology

IGCS International Announces Strategic Equity Investment by Lacks Enterprises

Published

18 minutes ago

April 22, 2026

DALLAS, April 22, 2026 /PRNewswire/ — IGCS International, a CVE-certified SDVOSB and leading provider of mission support and MRO supplies to the U.S. Department of Defense and federal agencies, today announced that Lacks Enterprises has acquired an equity stake in the company.

The strategic investment combines IGCS’s expertise in government supply chain, logistics, and MRO solutions with Lacks Enterprises’ advanced manufacturing capabilities, including electroplating, injection molding, composites, and testing for aerospace and defense.

“IGCS has built a strong track record supporting the Department of Defense… Partnering with Lacks Enterprises allows us to integrate cutting-edge manufacturing innovation into our offerings,” said Russ Spears, President of IGCS International.

Media Contact: Russ Spears, 214-733-7278, russ@igcsintl.com

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SOURCE IGCS International

Technology

Shoulder Innovations to Report First Quarter 2026 Financial Results on May 13, 2026

Published

18 minutes ago

April 22, 2026

GRAND RAPIDS, Mich., April 22, 2026 /PRNewswire/ — Shoulder Innovations, Inc. (“Shoulder Innovations”) (NYSE: SI), a commercial-stage medical technology company exclusively focused on transforming the shoulder surgical care market, today announced it will release financial results for the first quarter of 2026 after market close on Wednesday, May 13, 2026.

Management will host a conference call to discuss financial results beginning at 4:30 p.m. ET / 1:30 p.m. PT on May 13, 2026. Those interested in listening to the conference call may do so by dialing (877) 407-8216 for domestic callers or (412) 902-1015 for international callers and providing access code 13759613. A live and archived webcast of the event will be available in the “Investor Relations” section of the Shoulder Innovations website at https://ir.shoulderinnovations.com/.

About Shoulder Innovations
Shoulder Innovations is a commercial-stage medical technology company exclusively focused on transforming the shoulder surgical care market, with a current offering of advanced implant systems for shoulder arthroplasty. These systems are a core element of Shoulder Innovations’ ecosystem, which is designed to improve core components of shoulder surgical care – preoperative planning, implant design and procedural efficiency – to benefit each stakeholder in the care chain. Shoulder Innovations’ ecosystem is also comprised of enabling technologies, efficient instrument systems, specialized support and surgeon-to-surgeon collaboration. Together, these elements seek to address the long-standing clinical and operational challenges in the shoulder surgical care market by delivering predictable outcomes, procedural simplicity, and efficiency across all sites of care.

Contact
Brian Johnston or Sam Bentzinger
Gilmartin Group LLC
ir@shoulderinnovations.com

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SOURCE Shoulder Innovations

Technology

Accuray to Report Third Quarter Fiscal 2026 Financial Results on May 6, 2026

Published

18 minutes ago

April 22, 2026

MADISON, Wis., April 22, 2026 /PRNewswire/ — Accuray Incorporated (NASDAQ: ARAY) will report financial results for the third quarter of fiscal year 2026, ended March 31, 2026, during a conference call hosted by company management at 1:30 p.m. PT/4:30 p.m. ET on May 6, 2026.

The conference call dial-in numbers are 1-833-316-0563 (USA) or 1-412-317-5747 (international). In addition, a dial-up replay of the conference call will be available approximately one hour after the call’s conclusion for one week. The replay number is 1-855-669-9658 (USA) or 1-412-317-0088 (international), conference ID: 4178502.

A live webcast of the call will also be available from the Investor Relations section of the company’s website at investors.accuray.com. A webcast replay can be accessed on the website and will remain available until Accuray announces its results for the fourth quarter of fiscal 2026.

About Accuray
Accuray is committed to expanding the powerful potential of radiation therapy to improve as many lives as possible. We invent unique, market-changing solutions designed to deliver radiation treatments for even the most complex cases—while making commonly treatable cases even easier—to meet the full spectrum of patient needs. We are dedicated to continuous innovation in radiation therapy for oncology, neuro-radiosurgery, and beyond, as we partner with clinicians and administrators, empowering them to help patients get back to their lives, faster. Accuray is headquartered in Madison, Wisconsin, with facilities worldwide. To learn more, visit www.accuray.com or follow us on Facebook, LinkedIn, X, and YouTube.

Investor and Media Contact
Steve Monroe
VP, Financial Planning & Analysis, Accuray
Investor.relations@accuray.com

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SOURCE Accuray Incorporated