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Printed Circuit Board (PCB) Market to Grow by USD 26.8 Billion (2025-2029), Driven by Rising Smartphone Adoption, with Market Evolution Powered by AI – Technavio

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NEW YORK, Feb. 11, 2025 /PRNewswire/ — Report on how AI is driving market transformation – The global printed circuit board (PCB) market size is estimated to grow by USD 26.8 billion from 2025-2029, according to Technavio. The market is estimated to grow at a CAGR of over 6.2%  during the forecast period. Rising adoption of smartphones is driving market growth, with a trend towards increasing inclination toward flexibility and industry automation. However, environmental concerns regarding pcbs  poses a challenge. Key market players include APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd..

Key insights into market evolution with AI-powered analysis. Explore trends, segmentation, and growth drivers- View Free Sample PDF

Printed Circuit Board (PCB) Market Scope

Report Coverage

Details

Base year

2024

Historic period

2019 – 2023

Forecast period

2025-2029

Growth momentum & CAGR

Accelerate at a CAGR of 6.2%

Market growth 2025-2029

USD 26.8 billion

Market structure

Fragmented

YoY growth 2022-2023 (%)

5.8

Regional analysis

APAC, North America, Europe, Middle East and Africa, and South America

Performing market contribution

APAC at 88%

Key countries

China, Taiwan, South Korea, Japan, and India

Key companies profiled

APCT, China Circuit Technology Shantou Corp., Compeq Manufacturing Co. Ltd., Daedeok Electronics Co. Ltd., Dynamic Electronics Co. Ltd., Ibiden Co. Ltd., Jabil Inc., Korea Circuit Co. Ltd., NOK Corp., RAYMING TECHNOLOGY, Shenzhen Kinwong Electronic Co. Ltd, Shenzhen SenYan Circuit Co. Ltd., ShenZhen Wonderful Technology Co. Ltd, Shenzhen Zhongxinhua Electronics Co. Ltd., Sumitomo Electric Industries Ltd., TTM Technologies Inc., Victory Giant Technology (Huizhou) Co. Ltd., Vishal International, and Zhen Ding Technology Holding Ltd.

Market Driver

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices, particularly in sectors like 5G, Internet of Things (IoT), Internet of Vehicles, and consumer electronics. Key trends include the use of PCBs in smartphones, cameras, PCs, tablets, and consumer gadgets. However, environmental concerns surrounding electronic waste and the use of hazardous materials like lead, mercury, cadmium, and brominated flame retardants are driving the industry towards greener alternatives. Semiconductor plants and IC substrate manufacturers are investing in Rigid PCBs, Flexible Circuits, and Rigid Flex to meet the demands of automobile applications, battery control systems, engine timing systems, digital displays, audio systems, power relays, and antilock brake systems. The market is also witnessing in demand from smart devices and IoT gadgets, with companies like Quanta Computer and Apple being major suppliers. The PCB foundation material market is evolving, with a shift towards composite epoxy, fiberglass, and FR-4 materials. New technologies like 3D printing and industrial automation are transforming PCB production processes. Government institutions and industrial robots are also major consumers of PCBs for their high-temperature performance, structural integrity, and mechanical stress resistance. The PCB market is expected to continue growing, driven by the increasing demand for electronic equipment and the reliability of PCBs in various applications. However, challenges such as electrical property degradation and thermal stability must be addressed to ensure PCB reliability. 

The automation of industries is a growing trend as companies integrate computers and machines for improved control systems. To remain competitive, businesses must adopt automation, enabling optimal efficiency in productivity, operation costs, product quality, and safety. With the rising power density of electrical equipment, efficient power consumption is crucial. PCBs are essential in ensuring power efficiency within compact applications. Furthermore, the increasing adoption of cobots, industrial robots, and drones will enhance industrial automation, contributing to overall industry advancement. 

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 Market Challenges

The Printed Circuit Board (PCB) market faces significant challenges as the demand for electronic devices, particularly those integrating 5G, Internet of Things (IoT), Internet of Vehicles, and artificial intelligence. PCBs are essential components in consumer electronics, including smartphones, cameras, PCs, tablets, and more. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, and brominated flame retardants, which pose environmental concerns and regulatory challenges. Semiconductor plants and IC substrate manufacturers must address these issues while ensuring high-quality PCBs for industries such as communications, computer, and automobile applications. Flexible circuits, rigid flex, and composite epoxy materials like fiberglass and FR-4 are used in various applications, from digital displays and audio systems to battery control systems and engine timing systems. As the market evolves, new technologies like 3D printing and industrial automation emerge, offering potential solutions to the challenges of PCB production and reliability. Companies like Quanta Computer, an Apple supplier, and automobile manufacturers rely on rigid PCBs for their structural integrity and high-temperature performance. Government institutions and industries focusing on industrial robots and automation machinery also depend on PCBs for their electrical property degradation and thermal stability. In conclusion, the PCB market faces numerous challenges, including environmental concerns, regulatory pressures, and the need for high-performance materials. To meet these challenges, companies must focus on developing sustainable manufacturing processes and innovative materials, such as glass fabric, epoxy resin, and advanced fiberglass composites, to ensure the reliability and structural integrity of PCBs in various applications.The Printed Circuit Board (PCB) market involves the production and disposal of boards made up of hazardous components, primarily metal, plastic, ceramic, and copper, with epoxy resins containing a significant amount of chlorine. Previously, lead solders were used in PCBs, but the industry has shifted towards lead-free alternatives due to environmental concerns. Proper dismantling of components is necessary before disposing of the PCB. Recycling efforts face challenges such as temperature rises, mechanical shocks, and delamination. A standard PCB consi

sts of 40% metal, 30% plastic, and 30% ceramic, with the PCB itself comprising 28% of these materials. The industry is continually seeking sustainable solutions to minimize environmental impact.

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Segment Overview 

This printed circuit board (pcb) market report extensively covers market segmentation by  

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

1.1 Multi-layer-  Multi-layer Printed Circuit Boards (PCBs) continue to dominate the global market in 2024 due to their versatility and intricacy. These boards consist of multiple layers of substrate material interconnected by conductive pathways. The surging demand for compact and high-performance electronic devices in sectors like telecommunications, automotive, and consumer electronics fuels the need for multi-layer PCBs. Smartphones and advanced networking equipment, such as routers and servers, are prime applications. In the automotive industry, electronic control units (ECUs) benefit from the compact design of multi-layer PCBs, enabling efficient functionality in confined spaces. With technological advancements, the demand for multi-layer PCBs is projected to escalate, solidifying their role as a key product and driving the expansion of the global PCB market.

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Research Analysis

The Printed Circuit Board (PCB) market is experiencing significant growth due to the increasing demand for electronic devices in various sectors. The advent of 5G technology and the Internet of Things (IoT) are driving the market, with applications extending to the Internet of Vehicles (IoV), artificial intelligence (AI), and consumer electronics. Smartphones, cameras, and tripods are some of the consumer electronics that rely heavily on PCBs. In the industrial sector, PCBs are used in telecommunication infrastructure, PLCs, and transistors. PCBs come in various forms, including rigid, flexible, and rigid-flex, made from materials like composite epoxy and fiberglass. Integrated circuits, resistors, electrolytic capacitors, and transistors are essential components of PCBs. Shennan Circuits and IC Substrate are notable manufacturers of PCBs and IC substrates, respectively.

Market Research Overview

The Printed Circuit Board (PCB) market is witnessing significant growth due to the increasing demand for electronic devices in various sectors such as 5G, Internet of Things (IoT), Internet of Vehicles, artificial intelligence, consumer electronics, and more. PCBs are essential components in these devices, including smartphones, cameras, PCs, tablets, and more. However, the production of PCBs involves the use of materials like lead, mercury, cadmium, and brominated flame retardants, which have environmental concerns. Semiconductor plants, IC substrate manufacturers, and flexible circuits producers are key players in the PCB industry. PCBs are used in various applications, including communications equipment, industrial automation, medical devices, automobile applications, and more. PCBs are made of composite epoxy and fiberglass, with high dielectric strength, dimensional stability, electrical insulating qualities, mechanical strength, flame-retardant nature, thermal insulation properties, and high-temperature performance. PCB production involves various processes, including 3D printing, and the foundation material used can affect the reliability and electrical property degradation of the PCB. Government institutions and industrial robots are significant consumers of PCBs, and the market is expected to grow further due to the increasing demand for smart devices and IoT gadgets. Millennials’ preference for advanced technology is also driving the market’s growth. PCBs are essential for the structural integrity and mechanical stress resistance of electronic equipment, making them a critical component in various industries.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

TypeMulti-layerHDISingle SidedDouble SidedEnd-userCommunication Network InfrastructureIT And PeripheralsAutomotiveConsumer ElectronicsOthersGeographyAPACNorth AmericaEuropeMiddle East And AfricaSouth America

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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SOURCE Technavio

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Global AI Leader and Enterprise Transformation Visionary Zeya Ottomone Appointed Chief Executive Officer of Integrow

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Author of Empowered to Execute in the Agentic Era to Lead Next Generation of AI-Powered Enterprise Innovation

ATLANTA, July 24, 2026 /PRNewswire-PRWeb/ — Integrow announced the appointment of Zeya Ottomone as Chief Executive Officer, marking a significant milestone in the company’s evolution as it accelerates its vision to become a global leader in Agentic AI-powered enterprise software and business transformation.

Integrow announced the appointment of Zeya Ottomone as Chief Executive Officer, marking a significant milestone in the company’s evolution as it accelerates its vision to become a global leader in Agentic AI-powered enterprise software and business transformation.

With more than three decades of executive leadership spanning Fortune 500 enterprises, global technology organizations, and enterprise software innovation, Ottomone joins Integrow at a defining moment in the evolution of artificial intelligence.

Widely recognized for helping organizations modernize operations, simplify complex business ecosystems, and deliver measurable transformation outcomes, Ottomone has led some of the industry’s largest enterprise modernization initiatives across ERP, CRM, workforce management, cloud computing, cybersecurity, artificial intelligence, and intelligent automation. His appointment signals Integrow’s commitment to redefining how enterprises execute strategy in the era of autonomous AI.

“Artificial Intelligence is no longer about automation alone, it’s about empowering organizations to execute faster, make smarter decisions, and fundamentally rethink how work gets done,” said Zeya Ottomone, Chief Executive Officer of Integrow. “We’re entering the Agentic Era, where intelligent AI agents become trusted digital teammates capable of planning, reasoning, collaborating and executing alongside people. At Integrow, we’re building the enterprise platform that makes that future practical, secure and measurable for every organization.”

Ottomone is internationally recognized as a leader in enterprise technology, SaaS transformation, digital modernization and AI-enabled business strategy. Throughout his career he has held executive leadership and C-level positions with ABB, Honeywell, AmerisourceBergen, Cable & Wireless, Chicago Tribune and Rimini Street, leading global organizations through large-scale transformation initiatives across North America, Europe, Asia-Pacific and the Middle East. His expertise spans enterprise applications, Salesforce ecosystems, ServiceNow, ERP modernization, customer experience, intelligent operations, data strategy, and the emerging field of Agentic AI.

Before joining Integrow, Ottomone led global SaaS Centers of Excellence focused on enterprise transformation, helping organizations modernize critical business operations while reducing technology complexity and accelerating innovation. A certified Lean Six Sigma Master Black Belt and recognized executive advisor, Ottomone has consistently delivered operational excellence by combining strategic leadership with emerging technologies to create sustainable business value.

His appointment also coincides with the upcoming publication of his new book, Empowered to Execute in the Agentic Era, which explores how organizations can bridge the gap between strategy and execution by leveraging AI, empowering people, and building intelligent enterprises capable of continuous innovation. The book reflects many of the same principles that will guide Integrow’s next phase of growth: human-centered AI, intelligent automation, operational excellence, and measurable business outcomes.

Under Ottomone’s leadership, Integrow will accelerate investment across:

Agentic AIEnterprise AI PlatformsIntelligent ERPAI-powered CRMHuman Capital ManagementIT Service ManagementPredictive AnalyticsAutonomous WorkflowsEnterprise CopilotsIndustry-specific AI Solutions

The company’s vision is to deliver a unified enterprise platform where AI is embedded into every business process, enabling organizations to eliminate operational silos, automate decision-making, increase productivity, and create competitive advantage through intelligent execution. “Zeya represents exactly the type of visionary leader required for the next generation of enterprise software,” said Harvey Nicholson, Chair of Corporate Governance and Member of Integrow’s Board of Directors. “His global experience, deep understanding of enterprise technology, and forward-looking vision for Agentic AI position Integrow to become one of the industry’s most innovative AI-powered enterprise software companies.”

Wayne Gadson, Chair of Growth Strategy, added: “The future belongs to organizations that can execute strategy with intelligence, speed and confidence. Zeya has spent his career helping enterprises achieve exactly that. His appointment marks the beginning of an exciting new chapter for Integrow, our customers and our partners worldwide.” As enterprises face mounting pressure to modernize operations, reduce costs, improve workforce productivity and harness the power of artificial intelligence, Integrow is uniquely positioned to help organizations transform through a single AI-powered enterprise platform that unifies finance, operations, customer engagement, workforce management, projects and service delivery.

“Our mission is simple,” Ottomone concluded. “We don’t believe AI should replace people. We believe AI should elevate people. The organizations that will define the next decade won’t simply adopt AI—they’ll empower every employee to execute better decisions every day. That’s the future Integrow is building.”

About Integrow

Integrow is a global enterprise software company delivering next-generation AI-powered business applications built on Salesforce. The platform unifies ERP, CRM, Human Capital Management, IT Service Management, Project Management, Field Service, Finance and Operations into a single intelligent ecosystem enhanced by Agentic AI.

By embedding artificial intelligence into every workflow, Integrow enables organizations to modernize operations, accelerate innovation, improve decision-making and execute strategy with confidence.

For more information, visit www.integrow.com.

Media Contact

Media Team, Integrow, Inc., 1 855-333-4769, info@integrow.com, www.integrow.com 

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SOURCE Integrow, Inc.

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Lufax Announces Board and Management Changes

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SHANGHAI, July 24, 2026 /PRNewswire/ — Lufax Holding Ltd (“Lufax” or the “Company”) (NYSE: LU and HKEX: 6623), a leading financial services enabler for small business owners in China, today announced changes to its board of directors and senior management, effective July 25, 2026.

Ms. Fangfang Cai (“Ms. Cai”), Mr. Shibang Guo (“Mr. Guo”) and Mr. Peifeng Li (“Mr. Li”) have resigned as non-executive directors of the Company and from their respective positions on the Board’s committees. Mr. Tongzhuan Xi (“Mr. Xi”) has resigned as an executive director, the chief financial officer and the authorised representative of the Company (“Authorised Representative”) under Rule 3.05 of the Rules Governing the Listing of Securities on The Stock Exchange of Hong Kong Limited (“Hong Kong Listing Rules”), with effect from July 25, 2026. Each of the four directors cited personal work arrangements as the reason for their resignation and confirmed there is no disagreement with the Board and no matter relating to their departure that needs to be brought to shareholders’ attention.

The Company has begun a search for a new chief financial officer. During the transition, the CFO’s duties will be temporarily assumed by the Company’s internal team to ensure continuity of the Company’s financial functions. Mr. Xiang Ji, an executive director and the Company’s chief executive officer, has been appointed as the Authorised Representative, the Company’s designated liaison with the Stock Exchange under the Hong Kong Listing Rules, in place of Mr. Xi, with effect from July 25, 2026.

The Board has appointed Mr. Wai Kin Chim (“Mr. Chim”) as an independent non-executive director for an initial three-year term commencing July 25, 2026.

Mr. Chim, aged 65, has over 40 years of experience in international banking and extensive board experience in Asia Pacific, having worked in Hong Kong, Singapore and Beijing. He specializes in risk management and internal control, with a strong emphasis on corporate governance, credit risk, market risk and capital management.

Mr. Chim served as a loan officer at Standard Chartered Bank, Hong Kong Branch, from October 1985 to August 1988. He was then employed by Bankers Trust Company, Hong Kong Branch, as a vice president of the Asia Credit Department from September 1988 to October 1996. He subsequently served as the managing director and the chief credit officer for Deutsche Bank AG, a company listed on the Frankfurt Stock Exchange under ticker symbol DBK, for Asia Pacific (non-Japan Asia), from October 1996 to November 2006. He joined Bank of China Limited, a company listed on the Main Board of the Stock Exchange under stock code 3988, as the chief credit officer from March 2007 to March 2015.

Mr. Chim was an independent non-executive director of Standard Chartered Bank (China) Limited from October 2015 to October 2017. He served as an independent non-executive director of HDR Global Trading Limited, owner and operator of the BitMEX digital asset trading platform, from February 2021 to February 2022. Mr. Chim served as a non-executive director of China Chengtong Hong Kong Company Limited from July 2022 to June 2025. Mr. Chim is currently an independent non-executive director of OCBC Bank (Hong Kong) Limited, since November 2017; an independent non-executive director of Banco OCBC (Macau), S.A., since August 2023; an independent non-executive director of China Intellogis Technology Co., Ltd., since June 2024; and a director of Hong Kong Dance Company Limited since June 2026.

Mr. Chim obtained a Bachelor of Science degree from the Chinese University of Hong Kong in 1983 and an MBA degree from Indiana State University, USA, in 1985. He also graduated from the Senior Executive Program at Columbia University in 2000.

In connection with these changes, with effect from July 25, 2026, Ms. Cai will step down from the Nomination and Remuneration Committee, and Mr. Koon Wing Ernest Ip has been appointed as a member to that committee. The Company’s Special Committee will comprise Mr. Dicky Peter Yip, Mr. Koon Wing Ernest Ip and Mr. Siu Hong Cheng, continuing under the chairmanship of Mr. Dicky Peter Yip, with effect from July 25, 2026.

The Board would like to take this opportunity to thank Ms. Cai, Mr. Guo, Mr. Li and Mr. Xi for their service during the tenure of their office and warmly welcome Mr. Chim to the Board.

About Lufax

Lufax is a leading financial services enabler for small business owners in China. The Company offers financing products designed principally to address the needs of small business owners. In doing so, the Company has established relationships with 85 financial institutions in China as funding partners, many of which have worked with the Company for over three years.

Investor Relations Contact

Lufax Holding Ltd
Email: Investor_Relations@lu.com

ICR, LLC
Robin Yang
Tel: +1 (646) 308-0546
Email: lufax.ir@icrinc.com

 

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SOURCE Lufax Holding Ltd

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UMD Smith School Researchers Warn AI Security Lapses Highlight Urgent Need for Independent Oversight

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COLLEGE PARK, Md., July 24, 2026 /PRNewswire/ — A series of recent AI security lapses—including the OpenAI–Hugging Face breach—raises a fundamental question, say a pair of researchers at the University of Maryland’s Robert H. Smith School of Business: Can tech companies safely govern the powerful AI systems they build, or is stronger outside oversight now essential?

In its incident report, OpenAI confirmed that one of its experimental AI agents exploited a weakness in its testing environment while working on a routine benchmark task. The system wasn’t instructed to behave maliciously; instead, its persistence turned a small design flaw into a real escape. Earlier tests showed similar behavior, including agents that learned to bypass security checks by manipulating authentication tokens.

This pattern echoes findings from Dean’s Professor of Information Systems Siva Viswanathan at the Smith School, who studies how large technology platforms enforce rules. His research on mobile app privacy—published in Management Science—examined Google’s rollout of Android 6.0, which gave users more control over what data apps could collect. Developers were granted a flexible window to update their apps. Many used that flexibility to delay compliance for months, continuing to gather user data until Google imposed consequences such as lower search rankings and reduced visibility in its app store.

Viswanathan’s takeaway: when companies rely on voluntary compliance, self‑interested actors often exploit the slack. Real accountability requires pairing flexibility with firm, enforceable penalties.

That lesson now reverberates across the AI sector. As companies race to build increasingly capable systems, Viswanathan says oversight must treat these AI systems as strategic actors and must include strong safeguards that can pause or reverse a system before harm occurs.

He notes that a separate study from Anthropic underscores the stakes. In controlled tests, even an AI system designed to monitor another AI inherited the same flaws it was supposed to catch. In some cases, the “judge” model failed to flag clear sabotage because it agreed with the agent’s goals, allowing dangerous behavior to pass without human review.

Balaji Padmanabhan, Dean’s Professor of Decisions, Operations and Information Technologies and director of the Smith School’s Center for Artificial Intelligence in Business, extends Viswanathan’s governance argument into the realm of autonomous AI agents, warning that the same structural weaknesses now carry far higher stakes.

“The fact that this breach occurred organically without the AI agent being asked to be malicious is itself notable. Imagine what someone who actually intends to do harm can do. It’s also not terribly reassuring that the same firms we depend on for AI infrastructure, who are facing these issues, are the ones assuring enterprises that their systems with guardrails are perfectly safe,” says Padmanabhan. “We have to wake up to the fact that we’ve created capabilities that let software become as powerful as we want it to be—and then some. It’s time we seriously ask what’s needed to create an infrastructure to play defense well.”

Across the independent studies, the pattern is consistent, says Viswanathan: Voluntary compliance fails when the governed actor is more capable than the regulator. And AI systems cannot be governed by trust or good intentions alone. Oversight must be preventive, independent and capable of stopping harmful behavior before it spreads.

About the University of Maryland’s Robert H. Smith School of Business
The Robert H. Smith School of Business is an internationally recognized leader in management education and research. One of 12 colleges and schools at the University of Maryland, College Park, the Smith School offers undergraduate, full-time and flex MBA, executive MBA, online MBA, business master’s, PhD and executive education programs, as well as outreach services to the corporate community. The school offers its degree, custom and certification programs in learning locations in North America and Asia.

Contact: Greg Muraski, gmuraski@umd.edu

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SOURCE University of Maryland’s Robert H. Smith School of Business

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