AUBURN, Ala., April 22, 2026 /PRNewswire/ — As Artificial Intelligence (AI) becomes more integrated into daily life, Auburn University’s College of Education is sharpening its focus on this powerful tool and exploring how it can strengthen the preparation of future educators and healthcare workers.

Throughout the College of Education (and featured in the recent release of the college’s Keystone Magazine), artificial intelligence is being thoughtfully integrated across its four academic units, reflecting both the breadth of the college and a shared commitment to ethical, human-centered practice. Auburn College of Education Dean Jeffrey Fairbrother shared his perspective on how artificial intelligence aligns with the college’s vision for the future.

“In the College of Education, we’re committed to opening doors and improving lives, and artificial intelligence is an important door to opportunity,” he said. “I am proud of our faculty who are embracing AI to expand access, enhance learning and empower educators, always guided by ethics and integrity. By opening these doors today, we’re building a better future for all, far into the future.”

In the Department of Curriculum and Teaching, faculty are focused on teacher preparation and continuously improving methods of learning. Paul Fitchett, head of C&T, oversees several faculty members leading AI-focused initiatives, including some who are developing a course on the applied use of AI in the workplace that will come with industry credentialing.

“We are exploring AI through a number of different, applied facets,” Fitchett said. “Some individuals are leveraging AI to expand research capabilities while others are engaging AI to support teaching and learning, improving the educational experience for instructors and students alike.”

In Agricultural Education, Leadership and Communications, AI is treated as both a research tool and an object of study, with faculty developing a new AI course and even patent-pending technologies that support agriculture, Extension work and global food systems, always emphasizing the “expert in the loop” and transparency over blind automation. In Elementary Education, future teachers learn to use AI as a collaborative planning and efficiency tool, refining outputs through pedagogical expertise and deep knowledge of learners.

Margaret Flores, interim head of the Department of Special Education, Rehabilitation, and Counseling, emphasized the importance of research regarding how AI will impact these professions. SERC faculty members are working to integrate AI into their classrooms to inform their students about future uses in their careers.

In Clinical Rehabilitation Counseling, faculty are embedding AI directly into applied coursework, training students to critically evaluate AI-generated vocational data, labor market information and assessment recommendations while grounding decisions in professional judgment and ethics. In the School Counseling Program, students are prepared to navigate AI’s possibilities and limits through ethics-focused coursework and national research, reinforcing that empathy, nuance and confidentiality remain irreplaceable.

Meanwhile, the Education to Accomplish Growth in Life Experiences for Success (EAGLES) Program is leveraging AI as an equalizer for students with intellectual disabilities, using federally funded digital literacy and AI modules to promote independence, self-advocacy and access.

“AI can enhance the services or instruction that we provide, reduce administrative tasks and increase efficiency in research,” Flores said. “We must ensure that researchers are shaping how AI is changing our fields.”

In the Department of Educational Foundations, Leadership, and Technology, faculty are working with AI in multiple ways. Through basic and applied research, faculty are addressing early childhood vocabulary learning and mathematics learning, and learning how AI can help with research workflow, STEM learning and even the development of education policy.

Several faculty members are also incorporating AI into their classrooms, including the use of an AU tutor to support independent learning and AI-explicit language in teaching materials such as syllabi.

EFLT Department Head Hank Murrah said that his unit’s approach is about embracing the changes that come with AI while also working to shape how it will affect the future of education.

“We view AI as both a transformative research tool and a catalyst for innovation in teaching and learning,” Murrah said. “Our faculty are developing AI-driven interventions for STEM education, leveraging AI to streamline research workflows and exploring ethical frameworks for its use in classrooms. These efforts position us to prepare graduates who are not only AI-literate but capable of shaping evidence-based policy and practice. We believe AI will redefine how educators design learning experiences and how researchers generate insights—making education more adaptive, fair and impactful.”

Matt Miller serves as the director of the School of Kinesiology, whose faculty members are exploring how AI can help with conducting research and processing data to find ways to improve a person’s health. Within the School of Kinesiology, AI is being introduced in coursework related to exercise prescription and programming, helping students analyze data, tailor training plans and think critically about how emerging technologies can support safe, individualized, evidence-based practice.

“School of Kinesiology faculty members conduct research that yields large and complex datasets involving measures related to human movement, including but not limited to their physical activity throughout the day, brain activity during exercise, joint angles while walking or throwing a ball and protein expression after exercise training,” Miller said. “AI helps faculty members make sense of these measures to translate research findings into practical knowledge that can be used to enhance health and performance.”

Additionally, in the School of Kinesiology, the Sensorimotor and Rehabilitation (SMART) Neuroscience Lab studies the neuroscience of human movement using virtual and augmented reality simulations. And now, a new member of the lab has joined the team to help understand things like balance and walking: Circuit, the robotic “dog” who comes complete with artificial intelligence built in. Circuit is what’s called a quadruped robot (“robot dog”), and he’s used to explore new ways of supporting older adults’ safety at home.

Led by Director of Physical Therapy Harsimran Baweja, the SMART Neuroscience Lab is using Circuit to study whether robot dogs equipped with artificial intelligence and advanced sensors can reliably track human movement during everyday activities.

While there are many uses for AI, College of Education faculty members are also acutely aware that the human touch is an essential part of their work. The overall goal is to use AI to enhance the service provided to another human being, whether they are a student or a patient.

“Whatever their approach, integrity and professional ethics remain the driving force for our use of generative Artificial Intelligence,” Fitchett said. “Maintaining these principles is essential as we navigate an ever-changing landscape.”

Together, these efforts highlight a college-wide approach to AI that spans disciplines and populations, using emerging technologies not as replacements for human expertise, but as tools to expand opportunity, insight and impact.

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SOURCE Auburn University College of Education

The all-in-one creative machine combining Auto Heat Press, 3D Sublimation, Vacuum Forming, DTF Curing and Craft Baking launches on Kickstarter on April 28, 2026

Neuss, Germany, April 22, 2026 /PRNewswire/ — xTool, the world’s #1 desktop creative tools brand with over 500,000 users across 60+ countries, today announces the Kickstarter launch of the xTool WonderPress, the world’s first 5-in-1 Heat Creative Hub designed for makers, home-based apparel businesses, and creative entrepreneurs. The xTool WonderPress will officially launch on Kickstarter on April 28 at 18:00 PDT. Ahead of the campaign, creators can visit the xTool website now to explore the product and secure a £10 pre-sale reservation. This reservation locks in the Super Early Bird price starting at £249 (MSRP £349) and includes a complimentary £50 material bundle.

The WonderPress redefines what a heat press can do. With three easily swappable modules, users can master five distinct creative processes in one compact machine: Auto Heat Press, 3D Sublimation, Vacuum Forming, DTF Curing, and Craft Baking. For the first time, a single desktop device gives creators and small business owners access to a complete suite of heat-based creative tools — without the cost, space, or complexity of industrial equipment.

Three Modules. Five Professional Techniques.

The WonderPress’s tool-free, quick-change base design effortlessly transforms three distinct modules into five core capabilities:

Heat Press Module: Pro-grade 2D Auto Heat Press for Heat Transfer Vinyl (HTV), DTF, and sublimation. Optional Laser Positioning Pens ensure effortless, flawless alignment, significantly boosting commercial production speed.3D Form Module: Industrial-grade vacuum suction (−90 kPa) unlocks two distinct techniques: Vacuum Forming to clone 3D shapes in seconds for custom molds, and 3D Sublimation to wrap vibrant designs onto curved objects like phone cases.Craft Oven Module: A clean environment for Craft Baking (shrinking plastic, curing polymer clay, sublimating mugs) and professional DTF curing, with indoor-friendly H13 HEPA filtration. Paired with the Heat Press Module, it creates a seamless Cure & Press workflow for apparel businesses.

Professional Performance. Zero Compromises.

WonderPress ensures one-press, zero-peeling results. By doubling the heating tube density, it achieves ultra-even heat and edge-to-edge adhesion, guaranteeing professional heat consistency from centre to corner. Its high-precision system delivers up to 100 kg (220 lbs) of force in precise 1 kg increments. Coupled with an unprecedented 75 mm (3-inch) height clearance, creators can effortlessly process thick hoodies and bulky décor items.

The intuitive 1.8-inch display and xTool Studio preset library make WonderPress accessible for beginners while meeting the rigorous demands of small-to-medium businesses. Built-in air purification with an H13 HEPA filter makes DTF Curing safe for home use — a first in the industry.

A Creative Multiplier for Every Maker’s Workshop

WonderPress acts as the missing piece in any modern maker’s workflow. Whether adding 3D dimension to flat laser-cut projects, accelerating mass production for 3D printers, or serving as the ultimate finishing station for DTF and sublimation printers, WonderPress seamlessly integrates into any existing creative setup. For home-based apparel businesses selling on platforms like Etsy or Amazon Handmade, it combines DTF Curing and Auto Heat Press in one device — eliminating the need for multiple tools.

“WonderPress is a powerful new addition to the creative ecosystem we are building for half a million makers worldwide. For the first time, anyone can bring professional heat-based creation into their home or small business, safely, affordably, and as part of a growing suite of tools designed to unlock new creative possibilities.”

— xTool Europe

Availability and Pricing

About xTool

xTool is the world’s #1 desktop creative tools brand, a spin-off of Makeblock, one of the world’s leading STEAM education companies. Trusted by over 500,000 creators, makers, and small businesses across 60+ countries, xTool designs professional-grade laser engravers, heat presses, and UV printers that make advanced creative technology accessible to everyone. Key brand partners include Stanley, Microsoft Garage, and Ralph Lauren.

Learn more at www.xtool.com 

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AI-powered digital, analog and verification flows and broad IP solutions deliver exceptional quality of results for TSMC advanced technologies

Successful silicon bring-up of industry’s first low-power M-PHY v6.0 IP on TSMC N2P, tape-out of 64G UCIe IP, and 224G IP speeds development of next-generation AI systemsOngoing collaboration on AI-powered digital, analog, and verification flows and power integrity platforms across TSMC advanced nodes to deliver optimized quality of resultsCollaboration on agentic run assistance in Synopsys Fusion Compiler improves PPA and design productivity on TSMC A14 using TSMC NanoFlex™ Pro architectureSynopsys 3DIC Compiler platform delivers productivity improvement for TSMC’s CoWoS® technology at 5.5x reticle interposer sizes, enabling efficient 3D multi-die designsMultiphysics design enablement for COUPE supports next-generation co-packaged optics

SUNNYVALE, Calif., April 22, 2026 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) announced today major advances in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC’s most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16™ with Super Power Rail and A14.

By unifying intelligent digital, analog, and verification flows, advanced 3D multi-die design, and optical-to-electrical design capabilities, Synopsys helps engineers improve quality of multiphysics results and accelerate development cycles from silicon to systems for increasingly complex AI and high-performance computing designs.

“TSMC’s most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy efficiency in AI and autonomous systems,” said Michael Buehler-Garcia, Senior Vice President at Synopsys. “Through our deep collaboration, Synopsys is delivering AI-driven design flows, advanced multiphysics signoff, and a comprehensive portfolio of proven interface and foundation IP that help customers accelerate innovation and achieve outstanding quality of results.”

“Our collaboration with Open Innovation Platform® (OIP) ecosystem partners like Synopsys continues to expand across TSMC’s advanced nodes and 3DFabric® technologies to meet the rapidly growing demands of AI and high-performance computing,” said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. “By combining Synopsys’ certified EDA solutions and IP portfolio with our latest process and packaging innovations, we are enabling customers to push the boundaries of performance, integration, and energy efficiency—driving leadership silicon for the next-generation of AI systems.”

Advancing 3DFabric with Integrated Analysis and Signoff Flows for Optical, Electrical, and Thermal
To support the growing scale and complexity of multi-die designs, Synopsys and TSMC have enhanced enablement across TSMC’s 3DFabric technologies, including TSMC-SoIC® and CoWoS® for 5.5x reticle interposer sizes. Synopsys‘ 3DIC Compiler, a unified exploration-to-signoff platform, enables designs using TSMC’s 3DFabric technologies with automation capabilities for productivity gains. Synopsys‘ 3DIC Compiler integrates with RedHawk-SC™, RedHawk-SC Electrothermal™, and Ansys HFSS™ software to deliver multiphysics analysis for thermal, power, and high-speed signal integrity.

Collaboration with Synopsys RedHawk-SC™ for digital power integrity, Synopsys Totem™ for analog power integrity, and HFSS-IC Pro for electromagnetic extraction expands from TSMC A16™ to A14. Synopsys Totem-SC™ provides analog power integrity signoff at ultrahigh-capacity for large N2-based designs and embedded memories, while Synopsys PathFinder-SC™ extends multi-die electrostatic discharge (ESD) signoff coverage to N2. Cloud-based multiprocessor and GPU acceleration further shortens turnaround time, enabling multiphysics design teams to iterate rapidly across complex, thermally constrained 3D assemblies.

Expanded multiphysics simulation and analysis capabilities strengthen coverage across photonic, electrical, and thermal domains. Enablement for COUPE spans Ansys Zemax OpticStudio® for optical path simulation, Ansys Lumerical™ for photonic device simulation, HFSS-IC Pro for electromagnetic extraction, and RedHawk-SC Electrothermal for thermal and electrical co-simulation. Together, these tools support the design of co-packaged optical solutions for high-bandwidth datacenter connectivity.

Accelerating Design Productivity and Time-to-Results
Synopsys is collaborating with TSMC on agentic run assistance in Synopsys Fusion Compiler™ on TSMC’s A14 process using NanoFlex Pro architecture identifying timing improvement opportunities at different stages of the design flow for better quality of results. In addition, enablement of AI-assisted physical verification in Synopsys IC Validator™ is on-going, aiming to accelerate the identification and resolution of DRC violations for faster tapeout quality results.

Extensive IP Portfolio on Advanced, Specialty, and Automotive TSMC Nodes
This year, Synopsys advanced its IP portfolio with significant innovations that strengthened its leadership in high-performance connectivity for AI, data center, edge, and automotive markets. Through a key photonics collaboration, the company introduced a 224G IP solution that enables co-packaged optical Ethernet and UALink to address the bandwidth demands of next-generation electro-optical systems. Synopsys also achieved multiple first-silicon milestones on TSMC’s N5, N3P, and N2P processes— including PCIe 7.0, HBM4, 224G, DDR5 MRDIMM Gen2, LPDDR6/5X/5, UCIe 64G, and M-PHY v6.0 IP — establishing new levels in performance, power efficiency, and scalability.

Synopsys expanded its industry leading, silicon proven Foundation IP portfolio for TSMC’s N3P and N2P processes, offering embedded memories, logic libraries, and IOs that enable low power data centers, AI accelerators, mobile networks, and advanced cloud computing platforms. With strong market traction, industry leading PPA, and a robust roadmap across compact “C” nodes from N6 to N3, Synopsys Foundation IP is ready to power the next wave of semiconductor innovation.

Additionally, Synopsys strengthened its automotive leadership with the launch of a complete UCIe IP ASILB solution on N5A, complementing its high reliability Interface and Foundation IP offerings on TSMC’s N5A and N3A nodes for next-generation vehicle SoCs and reinforcing its momentum in the fast-growing automotive chiplet ecosystem.

Additional Resources

Blog: Learn about Synopsys’ silicon bring-up of M-PHY v6.0 IP on TSMC’s N2P process.Blog: Learn how Synopsys is delivering LPDDR6 Read/Write Eyes at 10.67 Gb/s on TSMC’s N2P process.Webinar: Gain executive-level insights from Synopsys, TSMC and others, into silicon and system engineering for AI hardware from experts at the forefront of these groundbreaking AI innovationsSynopsys is also hosting several demonstrations at Booth #302 in TSMC 2026 Technology Symposium in North America. For more information, visit Synopsys TSMC Technology Symposium page.

About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com.

© 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html. Other company or product names may be trademarks of their respective owners.

Contacts
Media   
Kelli Wheeler
Synopsys, Inc.
corp-pr@synopsys.com 

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SOURCE Synopsys, Inc.