TAIPEI, Aug. 19, 2026 /PRNewswire/ — In response to growing demand for advanced packaging and high-precision equipment, ISDN Precision System is set to unveil two new flagship products at the Automation Taipei 2026 (Booth: K628): the ApexTwin™ MFF Dual-Gantry Motion System, engineered specifically for back-end packaging, and the Vacuum Low-Profile High-Precision Module, designed for vacuum equipment. From large-format substrate manufacturing to precision positioning in vacuum environments, this launch underscores the company’s comprehensive product layout spanning linear motors, precision motion control, and mechatronics integration.

Dual-Gantry Architecture: ApexTwin™ Addresses Large-Format Advanced Packaging

Unlike conventional single-gantry architectures, the ApexTwin™ features a dual-gantry design capable of simultaneously executing two sets of process cycles, significantly enhancing equipment throughput and operational efficiency. The stage is equipped with the company’s linear motors and integrated with high-end motion controllers, forming a robust dual-drive architecture. It demonstrates six-axis synchronous control capabilities, achieving a settling time of 50ms @ 0.1 mm within ±300 nm.

Vibration control is also incorporated into the design. ApexTwin™ is equipped with a KURASHIKI KAKO Type-C active vibration isolation system to filter out external environmental vibrations.

Vacuum Low-Profile High-Precision Module: 33 mm Single-Axis Profile for Confined Spaces

The module is designed for vacuum equipment used in semiconductor and medical applications. In vacuum environments, the lack of air convection makes it difficult to dissipate heat generated by moving components, making thermal management an important factor affecting equipment stability.

To address this, ISDN Precision System has integrated its linear motor thermal dissipation technology into the module’s design, ensuring stable operation even under constrained cooling conditions. With its thinnest single-axis profile measuring just 33 mm, the module is ideal for high-precision equipment with limited internal installation space. Key applications include precision alignment for wafer inspection, pre-grinding wafer alignment, and precision positioning for vacuum coating of medical implants.

ISDN Precision System stated: “As advanced manufacturing continues to evolve, demand for precision motion and integration capabilities is increasing. The two new products we are launching target the critical market demands for ‘large-format, high-speed motion’ and ‘vacuum, ultra-thin precision positioning.’ Building on our core expertise in linear motor technology, we have integrated motion control, vibration isolation, and mechatronic technologies to provide equipment manufacturers with product options ranging from core motion components to precision platforms.”

To further demonstrate its technical prowess and application potential, ISDN Precision System will exhibit at the Automation Taipei from August 19 to August 22. Industry professionals are invited to visit Booth K628 on the 1st floor of Taipei Nangang Exhibition Center, Hall 1. A dedicated technical team will be on-site to provide in-depth demonstrations and technical consultations, jointly exploring future business opportunities in advanced manufacturing.

About ISDN Holdings Limited
Operating since 1986, ISDN Holdings Limited (SGX: I07) is a fast-growing multi-industry corporation focused on powering smart operations. We help businesses advance their digital capabilities for the Industry 4.0 era while maintaining a keen focus on clean energy in Asia.

About ISDN Precision System
Based in Taiwan, ISDN Precision System specializes in the local production of linear motors, high-precision gantries, and customized mechatronics solutions for the precision manufacturing sector. From its strategic base in Asia, the company has rapidly built an international network to deliver precise and tailored motion solutions to customers worldwide.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/isdn-precision-system-launches-two-new-products-at-automation-taipei-2026-targeting-advanced-packaging-and-vacuum-application-302850730.html

SOURCE ISDN Precision System

KUALA LUMPUR, Malaysia, Aug. 19, 2026 /PRNewswire/ — Intrinsic SEA was recently featured by The Edge Malaysia, one of Malaysia’s leading business and financial publications, highlighting the company’s work in technology localisation, cross-border industry collaboration and innovation ecosystem development. The feature reflects a broader shift in how global technology companies approach Southeast Asia — moving beyond conventional market entry towards deeper integration with local industries, talent, research capabilities and capital.

As global supply chains evolve and technological innovation accelerates, Intrinsic SEA believes successful internationalisation requires more than bringing products or technologies into a new market. It requires building the local capabilities that enable those technologies to grow, commercialise and create sustainable value over the long term.

This philosophy underpins Intrinsic SEA’s approach to technology localisation.

Rather than focusing solely on market access, the company works with international technology companies to develop pathways encompassing technology transfer, local partnerships, joint research and development, industry collaboration, investment facilitation and regional expansion. The objective is to enable global technologies to become meaningfully embedded within Malaysia’s industrial and innovation ecosystem, while using the country as a strategic platform for broader ASEAN growth.

Intrinsic SEA continues to connect innovation resources from China, Canada, Japan and other international markets with opportunities across Southeast Asia. Its areas of focus include artificial intelligence, advanced manufacturing, biotechnology and life sciences, clean energy, smart agriculture and other emerging technologies with the potential to address real industrial and societal needs.

A growing number of these collaborations are progressing from initial market engagement towards more substantive localisation. Intrinsic SEA is currently facilitating international technology projects across areas including AI-enabled agriculture, next-generation biotechnology, advanced manufacturing, intelligent mining and renewable energy. These initiatives explore opportunities ranging from commercial deployment and joint R&D to regional innovation centres and longer-term investment partnerships.

A central part of this strategy is the development of platforms that bring together government, industry, research institutions, investors and technology companies.

Intrinsic SEA serves as the Secretariat of the ASEAN Technology Cooperation and Development Summit (ATCDS), a regional platform designed to facilitate practical technology cooperation and connect global innovation with ASEAN’s industrial priorities.

The Summit brings together policymakers, international organisations, research institutions, technology leaders, corporations and investors to explore collaboration across key areas including artificial intelligence, future mobility, advanced manufacturing, healthcare and biotechnology, the digital economy, clean energy and other emerging sectors.

Beyond dialogue, the ASEAN Technology Cooperation and Development Summit is designed to facilitate tangible outcomes — from technology partnerships and investment opportunities to cross-border R&D, commercialisation and industry deployment. By connecting international technologies with real regional demand, the platform seeks to contribute to a more integrated and globally connected ASEAN innovation ecosystem.

“The next phase of global technology competition will not be determined by technology alone. It will increasingly depend on the strength of innovation ecosystems, international collaboration and the ability to translate innovation into real industrial value,” said Ravenna Chen, CEO of Intrinsic SEA.

“Our role is to connect global innovation with local opportunity — helping technologies establish meaningful roots in Malaysia, develop alongside local partners and ultimately create value across ASEAN. We believe localisation should not simply be about entering a market; it should be about building capabilities and growing together with that market.”

Malaysia’s established industrial base, international connectivity, talent pool and position at the heart of Southeast Asia make it well placed to serve as a bridge between global innovation and ASEAN’s growing technology economy. Intrinsic SEA sees this position not simply as a gateway to the region, but as an opportunity for Malaysia to play a more active role in shaping how emerging technologies are developed, adapted and commercialised for ASEAN.

Looking ahead, Intrinsic SEA will continue to deepen its work across international technology cooperation, technology transfer, industry development and investment collaboration. Through its own initiatives and platforms including the ASEAN Technology Cooperation and Development Summit, the company aims to work alongside governments, corporations, research institutions, investors and international partners to translate global innovation into sustainable commercial and societal value across Southeast Asia.

About Intrinsic SEA

Intrinsic SEA is an international technology cooperation and innovation platform headquartered in Kuala Lumpur, Malaysia. The company focuses on strategic advisory, technology transfer, industry collaboration and investment facilitation, connecting innovation resources across China, Canada, Japan, Southeast Asia and other global markets.

With a focus on sectors including artificial intelligence, advanced manufacturing, biotechnology, clean energy and emerging technologies, Intrinsic SEA supports international companies in building sustainable local capabilities and developing long-term opportunities across ASEAN. The company also serves as the Secretariat of the ASEAN Technology Cooperation and Development Summit, supporting cross-border collaboration among governments, industry, capital and research institutions.

View original content to download multimedia:https://www.prnewswire.com/apac/news-releases/intrinsic-sea-advances-technology-localisation-to-strengthen-aseans-innovation-ecosystem-302854755.html

SOURCE Intrinsic SEA

Smart Manufacturing and Advanced Packaging Emerge as Key Growth Areas

HSINCHU, Aug 19, 2026 /PRNewswire/ — AI is reshaping semiconductor manufacturing. SEMI projects that 300mm fab equipment spending will exceed US$150 billion in 2027, driven by demand for AI chips, advanced capacity, and supply chain resilience. Against this backdrop, SEMI announced 15 key industry themes for SEMICON Taiwan 2026. Under the theme “Transform Tomorrow”, the exhibition will bring together leaders to explore technologies and partnerships shaping the industry’s next decade.

As the industry moves from process scaling toward system-level innovation, AI-driven smart manufacturing and advanced packaging are areas of focus. SEMICON Taiwan 2026 will debut the Smart Fab Zone.

Advanced Process Strengths Extend into Smart Manufacturing and Advanced Packaging

“AI-era competition is advancing on two fronts: AI-powered smart manufacturing that upgrades production systems, and advanced packaging that enables higher levels of performance integration,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “Taiwan’s strengths in advanced process technologies provide a strong foundation for both. This year, the Smart Manufacturing Pavilion has grown 20% year over year, becoming the largest and fastest-growing exhibition area, while the Packaging Technology Area has grown 6% to become the second largest. Together with advanced processes, quantum, sustainability, cybersecurity, and other key themes, these areas form the blueprint for SEMICON Taiwan 2026. The next decade of semiconductors will be shaped by ecosystem-wide collaboration, and that is how we Transform Tomorrow.”

AI Powers the Next Stage of Smart Manufacturing

AI-enabled manufacturing is becoming central to semiconductor production as fabs adopt AI inspection, industrial IoT, robotics, and autonomous decision-making to improve precision and efficiency.

SEMICON Taiwan 2026 will feature the Smart Manufacturing Pavilion and Smart Fab Zone.

Advanced Packaging Drives System-Level Integration

As scaling approaches limits, competition is shifting toward system-level integration. SEMI reports that packaging and assembly equipment sales grew 19.6% in 2025 to a record US$6 billion, with 9.2% growth expected in 2026. SEMI has worked with TSMC and ASE to launch the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), strengthening collaboration and Taiwan’s role in the advanced packaging.

The Packaging Technology Area will feature four zones: 3DIC Advanced Packaging Pavilion, FOPLP Pavilion, Semiconductor Packaging Pavilion, and Chiplet Pavilion.

Registration

Registration for SEMICON Taiwan 2026 is now open. For registration details and information, visit the official website.

About SEMI

SEMI® is the global industry association connecting more than 4,000 member companies and 1.5 million professionals across the semiconductor and electronics design and manufacturing supply chain. SEMI helps members address critical industry challenges through advocacy, workforce development, sustainability, supply chain management and other programs. SEMICON® Taiwan events, technology communities, standards and market intelligence support business growth and innovation across design, devices, equipment, materials, services and software – advancing smarter, faster and safer electronics. Learn more at www.semi.org or follow SEMI on Facebook, LinkedIn and LINE.

View original content:https://www.prnewswire.com/apac/news-releases/semicon-taiwan-2026-highlights-ai-driven-manufacturing-transformation-302853886.html

SOURCE SEMI