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Electronic Adhesives Market size is set to grow by USD 2.29 billion from 2024-2028, Technological advancements in adhesives boost the market, Technavio

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NEW YORK, Aug. 14, 2024 /PRNewswire/ — The global electronic adhesives market size is estimated to grow by USD 2.29 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of almost 6.78%  during the forecast period. Technological advancements in adhesives is driving market growth, with a trend towards new product launches by players. However, fluctuating raw material prices  poses a challenge. Key market players include 3M Co., Arkema Group, Avery Dennison Corp., Beiersdorf AG, Chemence Inc., Dow Chemical Co., Dr. Honle AG, DuPont de Nemours Inc., Dymax Corp., Elkem ASA, EpoxySet Inc., H.B. Fuller Co., Henkel AG and Co. KGaA, Indium Corp., LG Corp., Master Bond Inc., Meridian Adhesives Group, Parker Hannifin Corp., RAG Stiftung, Sika AG, and Sony Group Corp..

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Electronic Adhesives Market Scope

Report Coverage

Details

Base year

2023

Historic period

2018 – 2022

Forecast period

2024-2028

Growth momentum & CAGR

Accelerate at a CAGR of 6.78%

Market growth 2024-2028

USD 2299 million

Market structure

Fragmented

YoY growth 2022-2023 (%)

6.23

Regional analysis

APAC, Europe, North America, South America, and Middle East and Africa

Performing market contribution

APAC at 69%

Key countries

China, India, US, UK, and Japan

Key companies profiled

3M Co., Arkema Group, Avery Dennison Corp., Beiersdorf AG, Chemence Inc., Dow Chemical Co., Dr. Honle AG, DuPont de Nemours Inc., Dymax Corp., Elkem ASA, EpoxySet Inc., H.B. Fuller Co., Henkel AG and Co. KGaA, Indium Corp., LG Corp., Master Bond Inc., Meridian Adhesives Group, Parker Hannifin Corp., RAG Stiftung, Sika AG, and Sony Group Corp.

Market Driver

The global electronic adhesives market is experiencing significant growth due to new product launches by both regional and international players. These new offerings contribute to increased revenue and expanded consumer bases for vendors. For instance, in May 2024, DELO introduced DELO DUALBOND EG6290, a closed-cavity packaging solution for semiconductors and monitoring systems. In November 2022, Dow Inc. Launched VORATRON MA 8200S, a high-bonding adhesive for electric vehicle battery packs. Additionally, Indium Corporation unveiled InTACK, a new adhesive solution for semiconductor applications, at PCIM Europe in April 2022. These new product launches not only enhance market shares but also provide a competitive edge for companies in the global electronic adhesives market. 

The Electronic Adhesives market is thriving in various industries including Electronics, Surface mounting on PCBs, Semiconductors, and more. Trends such as miniaturization/automation in Computers, Communications, Consumer goods, Industrial, Medical, Automotive, and Mobile devices drive the demand for these adhesives. Epoxies and silicones are popular choices due to their thermal conductivity, electrical conductivity, durability, and optical clarity. Potting & encapsulations are essential for protecting electronic circuits, while chip-scale packaging and power semiconductors require high-performance adhesives. The Communications industry, including fiber-optic connectivity, data centers, and optical transceivers, relies heavily on electronic adhesives. Eco-friendly, non-toxic options are increasingly preferred for environmental concerns. Adhesives used in touch screens & displays, medical electronic systems, and optomechanical assemblies require specific properties like cure speed and optical clarity. Key players include network companies, wireless carriers, broadband carriers, and electronic component manufacturers. The market continues to grow with advancements in technology and the increasing use of epoxies and silicones in various applications. 

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Market Challenges

•         The electronic adhesives market is influenced by the cost structure of raw materials and their availability. Key materials include plastic resins, synthetic rubber, inorganic chemicals, industrial inorganic chemicals, and refined petroleum products. Fluctuations in oil prices, driven by global demand and Middle Eastern political unrest, impact these materials’ costs. Additionally, high logistics costs due to fuel price increases add to the challenge. Manufacturers face pressure to keep prices low for electronic adhesives, which are cost-intensive to produce. Electrical conductive adhesives (ECAs) cost is directly related to their electrical conductivity, and price volatility can negatively impact the market. Factors like ease of application, viscosity, electrical conductivity, and mechanical properties influence ECA costs and end-user industry operating costs. Therefore, price instability may hinder the growth of the global electronic adhesives market.

•         The Electronics industry, including sectors like Automotive, Medical Devices, Luxury Packaging, MRO, and 3D Printing, faces unique challenges in adhesive selection. Bostik and Henkel are key players in this market. At Formnext in Frankfurt, technological advancements like contactless interaction and 3D Printing are driving demand for customized adhesives. Attributes like high strength, flexibility, electrical properties, and rapid curing are essential. Raw material prices, miniaturized devices, and urbanization push the need for non-stringing, long shelf life, and non-viscosity change adhesives. Challenges in chip bonding, printeds circuit boards, and soldering techniques like wave soldering, reflow soldering, and tin-soldering require UV curing adhesives and acrylics or urethane acrylates. Safety technologies, infotainment systems, and connectivity in electric vehicles call for high-performance adhesives. The Automotive and Medical Devices sectors also prioritize air entrapment prevention and pot life extension. The Indian government’s Atmanirbhar initiative further boosts local production and self-reliance in the electronics sector.

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Segment Overview 

This electronic adhesives market report extensively covers market segmentation by  

Application 1.1 Surface mounting1.2 Conformal coating1.3 Wire tacking1.4 Potting and encapsulationProduct 2.1 Electrically conductive adhesives2.2 Thermally conductive adhesives2.3 UV curing adhesives2.4 OthersGeography 3.1 APAC3.2 Europe3.3 North America3.4 South America3.5 Middle East and Africa

1.1 Surface mounting-  The electronic adhesives market has experienced growth due to the increasing use of surface mounting adhesives in various industries. Surface mounting adhesives are essential in surface mounting assemblies for PCBs, ensuring components remain in place during high-speed production processes. Heraeus, a leading vendor in the market, offers one-component thermo-setting solvent-free surface mounting adhesives with high surface insulation resistance for applications such as printing, dispensing, pin transfer, and jetting. Master Bond Inc. Provides dielectric and conductive surface mounting adhesive systems for major electrical applications, enhancing functionality and productivity. Their silver-filled thixotropic epoxy paste adhesives can replace metallurgical solders in surface mounting assembly applications, adhering to a wide range of substances. Key industries, including medical, aerospace, electronics, automotive, and specialty OEMs, have benefited from surface mounting adhesives, enabling efficient component dispensing and increased productivity. As a result, the surface mounting segment is projected to expand significantly, driving the global electronic adhesives market throughout the forecast period.

For more information on market segmentation with geographical analysis including forecast (2024-2028) and historic data (2017-2021) – Download a Sample Report

Learn and explore more about Technavio’s in-depth research reports

The Global Industrial Adhesives Market is projected to grow significantly, driven by rising demand in automotive, construction, and electronics industries. Key players are focusing on eco-friendly adhesives and technological advancements. Similarly, the Global Phenolic Resin Market is expected to expand due to its increasing use in insulation, laminates, and coatings. This market is characterized by innovations in product formulations to enhance performance and sustainability. Both markets are influenced by growing industrialization and demand for high-performance materials in emerging economies.

Research Analysis

Electronic adhesives are essential materials used in the electronics industry for various applications, including surface mounting, PCBs, semiconductors, potting & encapsulations, and electronic circuits. They are used in various sectors such as computers, communications, consumer goods, industrial, and more. Electronic adhesives come in different forms, including epoxies and silicones, coatings, and electrically conductive adhesives. These adhesives play a crucial role in bonding electronic components to circuit boards and in the encapsulation of sensitive electronic components. Technological advancements in the electronics industry, such as the development of 5G infrastructure networks and the production of smartphones, have led to an increased demand for electronic adhesives. However, environmental factors and raw material prices can impact the market. Tin-lead solders, contactless interaction, and chip bonding are other areas where electronic adhesives are used. UV curing adhesives and tin-soldering are also popular methods used in the industry. The market for electronic adhesives is expected to grow significantly due to the increasing demand for electronic devices and the need for reliable and efficient bonding solutions.

Market Research Overview

Electronic adhesives play a crucial role in the electronics industry, enabling surface mounting of components on Printed Circuit Boards (PCBs) and securing the attachment of semiconductors. These adhesives are essential in various sectors, including computers, communications, consumer goods, industrial, medical, automotive, and more. The market encompasses epoxies and silicones, used for potting & encapsulations, electronic circuits, and chip-scale packaging. Electronic adhesives offer attributes like thermal conductivity, electrical conductivity, durability, optical clarity, and cure speed. They are eco-friendly and non-toxic, making them suitable for diverse applications. In the communications industry, they contribute to fiber-optic connectivity, data centers, and optical transceivers. In the mobile electronic devices sector, they are integral to touch screens & displays, smartphones, and wireless communication. The market is influenced by technological advancements, product launches, and product portfolio expansion. Raw material prices, environmental factors, and the growing demand for 5G infrastructure networks also impact the market. Epoxies and silicones are widely used in various applications, from power semiconductors to optomechanical assemblies. Network companies, wireless carriers, and broadband carriers are significant consumers of electronic adhesives. The market includes various resin types, such as epoxy resin, silicone resin, acrylic resin, polyurethane resin, and others. Applications range from industrial to commercial aviation, luxury packaging, MRO, and more. Key trends include miniaturization/automation, customization, and the increasing use of electrically conductive adhesives as alternatives to tin-lead solders. Major events like Formnext in Frankfurt showcase the latest technological advancements and product offerings. Companies like Henkel and Bostik are significant players in the market, catering to various industries and applications. The market continues to evolve with the increasing demand for eco-friendly, non-toxic adhesives and the growing importance of 5G infrastructure networks and electric vehicles.

Table of Contents:

1 Executive Summary
2 Market Landscape
3 Market Sizing
4 Historic Market Size
5 Five Forces Analysis
6 Market Segmentation

ApplicationSurface MountingConformal CoatingWire TackingPotting And EncapsulationProductElectrically Conductive AdhesivesThermally Conductive AdhesivesUV Curing AdhesivesOthersGeographyAPACEuropeNorth AmericaSouth AmericaMiddle East And Africa

7 Customer Landscape
8 Geographic Landscape
9 Drivers, Challenges, and Trends
10 Company Landscape
11 Company Analysis
12 Appendix

About Technavio

Technavio is a leading global technology research and advisory company. Their research and analysis focuses on emerging market trends and provides actionable insights to help businesses identify market opportunities and develop effective strategies to optimize their market positions.

With over 500 specialized analysts, Technavio’s report library consists of more than 17,000 reports and counting, covering 800 technologies, spanning across 50 countries. Their client base consists of enterprises of all sizes, including more than 100 Fortune 500 companies. This growing client base relies on Technavio’s comprehensive coverage, extensive research, and actionable market insights to identify opportunities in existing and potential markets and assess their competitive positions within changing market scenarios.

Contacts

Technavio Research
Jesse Maida
Media & Marketing Executive
US: +1 844 364 1100
UK: +44 203 893 3200
Email: media@technavio.com
Website: www.technavio.com/

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Mastech Digital to Announce Second Quarter 2026 Financial Results; Participate in Upcoming Investor Conference

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PITTSBURGH, July 24, 2026 /PRNewswire/ — Mastech Digital, Inc. (NYSE American: MHH) (“Mastech Digital”), a leading provider of Digital Transformation IT Services, today announced the date for the release of its financial results for the second quarter ended June 30, 2026, and its participation in an upcoming investor conference.

Second Quarter 2026 Earnings:

Mastech Digital will report its financial results for the second quarter 2026 before the market opens on Thursday, August 6, 2026. Management will host a live conference call and webcast at 9:00 a.m. Eastern Time on that day to discuss the Company’s financial performance and operating results.  The conference call will be hosted by Nirav Patel, President and CEO, and Kannan Sugantharaman, Chief Financial and Operations Officer.

Those wishing to participate via webcast should access the call through Mastech Digital’s Investor Relations website at https://investors.mastechdigital.com. Those wishing to participate via telephone may dial in at 1-800-715-9871 (USA) or 1-646-307-1963 (International) with the passcode 7506988. The replay will be available via webcast through Mastech Digital’s Investor Relations website.

Upcoming Investor Conference:

Mr. Sugantharaman will host a fireside chat at the Sidoti Micro-Cap Investor Conference on Wednesday, August 19, 2026, at 9:15 a.m. Eastern Time.

Mastech Digital management is scheduled to host virtual one-on-one and small group meetings with investors during the conference on August 19-20, 2026. Investors interested in arranging a meeting should contact their Sidoti representative or reach out to the Mastech Digital investor relations team at investors@mastechdigital.com.

About Mastech Digital, Inc.

Mastech Digital (NYSE American: MHH) is a leading provider of Digital Transformation IT Services. The Company offers Data Management, Analytics & AI Solutions, and IT Staffing Services with a digital-first approach. A minority-owned enterprise, Mastech Digital is headquartered in Pittsburgh, PA, with offices across the U.S., Canada, Europe, and India. Visit us at www.mastechdigital.com.

Investor Relations Contact:
investors@mastechdigital.com 

 

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SOLAI Limited Announces Extraordinary General Meeting

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AKRON, Ohio, July 24, 2026 /PRNewswire/ — SOLAI Limited (NYSE: SLAI) (“SOLAI” or the “Company”) (previously known as “BIT Mining Limited”), a technology-driven personal AI and digital infrastructure provider, today announced that it will hold its extraordinary general meeting of shareholders at 428 South Seiberling Street, Akron, Ohio, US on August 14, 2026 at 10:00 a.m., New York time.

Holders of record of ordinary shares and preference shares of the Company at the close of business on July 20, 2026, New York time (the “Record Date”) are entitled to receive notice of, and to attend and vote at, the extraordinary general meeting or any adjournment thereof. Holders of the Company’s American Depositary Shares (“ADSs”) who wish to exercise their voting rights for the underlying ordinary shares must act through the depositary of the Company’s ADS program, Deutsche Bank Trust Company Americas.

The notice of the extraordinary general meeting, which sets forth the resolutions to be submitted to shareholder approval at the extraordinary general meeting is available on the Investor Relations section of the Company’s website at https://ir.solai.com

About SOLAI Limited

SOLAI Limited (previously known as “BIT Mining Limited”) (NYSE: SLAI) (previously traded under “BTCM”) is a technology-driven personal AI and digital infrastructure provider. Building upon its historical legacy in digital asset mining and blockchain network operations, the Company is leveraging extensive experience in large-scale hardware deployment, data center operations, and high-performance computing to build the foundational infrastructure for personal AI computing and digital asset ecosystems globally.

For more information:

SOLAI Limited
ir@solai.com
ir.solai.com
www.solai.com 

Christensen Advisory
Jason Ng
Tel: +852-2117-0861
Email: solai@christensencomms.com 

 

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/U P D A T E — TrendAI/

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This release has been updated to include new information provided by TrendAI. The complete, corrected release follows, with additional details at the end:

TrendAI™ Adopts Claude Opus 5 to Advance Vulnerability Prioritization and Virtual Patching

As a participant in Anthropic’s Cyber Verification Program, TrendAI applies frontier reasoning to convert vulnerability intelligence into faster protection across hybrid environments

DALLAS, July 24, 2026 /PRNewswire/ — TrendAI™, the enterprise AI security leader from Trend Micro Incorporated (TYO: 4704; TSE: 4704), today announced it is adopting Claude Opus 5, Anthropic’s latest and most capable Opus model, to help security teams convert vulnerability intelligence into immediate protection, from prioritization to virtual patching. The move builds on TrendAI’s collaboration with Anthropic on Claude Opus 4.8, extending the same defensive focus to a model that delivers step-change gains in advanced reasoning, agentic workflows, and long-horizon analysis. As AI makes finding vulnerabilities easier than ever, the harder problem becomes protecting organizations faster than software can be permanently patched, and that is where TrendAI is putting Opus 5 to work.

As a participant in Anthropic’s Cyber Verification Program, which credentials organizations for the defensive use of frontier AI models, TrendAI is positioned to apply Claude Opus 5 to defensive security as access becomes available. The model is Zero Data Retention compatible, supporting TrendAI’s governance and data-protection requirements as it scales AI across security operations.

The work extends to TrendAI Threat Research, where frontier AI models are combined with our proprietary frontier intelligence engine and human expertise to generate pre-disclosure intelligence. Those insights power TrendAI Vision One™, delivering stronger detection, deeper forensic insights, and proactive protection through virtual patching.

Rachel Jin, Chief Platform and Business Officer, Head of TrendAI™:
“With Claude Opus 5, TrendAI can move from vulnerability intelligence to action faster than ever, prioritizing what matters most by exploitability and business impact. Finding the vulnerability was always the hard part. Now the challenge is protecting organizations faster than software can be permanently patched, and frontier reasoning is what changes that equation, extending all the way to virtual patching that protects customers before a vendor fix ships. This is what it means to secure the AI age, fearlessly.”

These capabilities support TrendAI Vision One™ in helping security analysts, AppSec teams, and SOC teams prioritize exposure, map attack paths, and accelerate mitigation, including virtual patching, across hybrid environments, moving vulnerability management from a static scanning process into a faster, context-aware risk mitigation workflow.

About TrendAI™
TrendAI™, the global AI security leader and enterprise business unit of Trend Micro, empowers organizations with full AI visibility and consolidated security that inspires confidence, drives innovation, and eliminates risk. Trusted by the largest enterprises and governments across 185 countries, TrendAI™ secures the entire organization, from identities, to infrastructure, to data. Global Fortune 500 companies rely on TrendAI™ to cut risk and stop threats up to three months earlier, powered by world-leading threat and attack intelligence. Through deep ecosystem partnerships with market leaders like NVIDIA, Anthropic, AWS, Google, and Microsoft, TrendAI™ empowers your organization to securely drive forward at the speed of AI. AI Fearlessly. Learn more: trendaisecurity.com

About Anthropic
Anthropic is an AI safety and research company dedicated to building reliable, interpretable, and steerable AI systems. Its Claude family of models, including Claude Opus 5, enables advanced capabilities across a wide range of applications, including code understanding and security analysis.

Update: The latest version of this release includes additional statements from TrendAI related to the original announcement.

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